公开(公告)号：US20250149252A1

公开(公告)日：2025-05-08

申请号：US18837696

申请日：2022-12-02

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA ,  Takashi KARIYA ,  Yasunori HARADA ,  Yoshiaki HAYAMIZU ,  Miyu HASEGAWA

IPC: H01G4/33 ,  H01G4/008 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor includes a metal foil having a roughened surface, a dielectric film covering the roughened surface of the metal foil and having an opening partially exposing the metal foil therethrough, an electrode layer contacting the metal foil through the opening, and an electrode layer contacting the dielectric film without contacting the metal foil. An upper surface position of the electrode layer is equal to or lower in height than that of the electrode layer.

公开(公告)号：US20250120104A1

公开(公告)日：2025-04-10

申请号：US18836446

申请日：2022-12-02

Applicant: TDK Corporation

Inventor： Yasunori HARADA ,  Yoshiaki HAYAMIZU ,  Daiki ISHII ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA

IPC: H10D1/68

Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor 1 includes a metal foil having a non-roughened center portion and a roughened upper surface, a dielectric film covering the roughened upper surface of the metal foil, an electrode layer contacting the non-roughened center portion of the metal foil through an opening formed in the dielectric film, and an electrode layer contacting the dielectric film without contacting the metal foil. A thickness of the center portion of the metal foil at a position overlapping the electrode layer is larger than a thickness thereof at a position overlapping the electrode layer.

公开(公告)号：US20180027660A1

公开(公告)日：2018-01-25

申请号：US15654281

申请日：2017-07-19

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Mitsuhiro TOMIKAWA

IPC: H05K1/18 ,  H05K1/03 ,  H01L23/00 ,  H05K1/11

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/08155 ,  H01L2224/27436 ,  H01L2224/73265 ,  H05K1/036 ,  H05K1/115

Abstract: An electronic component embedded substrate 1 includes a substrate 10 having a wiring layer 11 and an insulating layer 12; an electronic component 20 built in the substrate 10, and having a pair of electrode layers 21A and 21B, and a dielectric layer 22; and a stress relieving layer 30 provided closer to the wiring layer 11 than the insulating layer 12 is in the lamination direction, wherein at least part of an end portion of the electronic component 20 on the wiring layer 11 side is in contact with the stress relieving layer 30, wherein at least part of an end portion of the electronic component 20 on the insulating layer 12 side is in contact with the insulating layer 12, and wherein the Young's modulus of the stress relieving layer 30 is lower than the Young's modulus of the electrode layer 21B.

公开(公告)号：US20230060995A1

公开(公告)日：2023-03-02

申请号：US17896744

申请日：2022-08-26

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Koichi TSUNODA

IPC: H01F27/29 ,  H01F17/00 ,  H01G4/38

Abstract: Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.

公开(公告)号：US20190304701A1

公开(公告)日：2019-10-03

申请号：US16360405

申请日：2019-03-21

Applicant: TDK CORPORATION

Inventor： Daiki ISHII ,  Kazuhiro YOSHIKAWA ,  Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Junki NAKAMOTO ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/12 ,  H01G4/008

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.

公开(公告)号：US20170373009A1

公开(公告)日：2017-12-28

申请号：US15633013

申请日：2017-06-26

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Mitsuhiro TOMIKAWA ,  Eiko WAKATA

IPC: H01L23/538 ,  H01G4/228 ,  H01G4/005

CPC classification number: H01L23/5385 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/33 ,  H01G4/40 ,  H05K1/162 ,  H05K2201/0195 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10537 ,  H05K2201/10545

Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

公开(公告)号：US20240203972A1

公开(公告)日：2024-06-20

申请号：US18589812

申请日：2024-02-28

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Koichi TSUNODA ,  Mitsuhiro TOMIKAWA

IPC: H01L27/01 ,  H01L21/70 ,  H01L23/00

CPC classification number: H01L27/01 ,  H01L21/702 ,  H01L24/05 ,  H01L24/03 ,  H01L2224/03462 ,  H01L2224/05012 ,  H01L2224/05015 ,  H01L2224/05016 ,  H01L2224/05582 ,  H01L2224/05638 ,  H01L2224/05655 ,  H01L2924/01014

Abstract: Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.

公开(公告)号：US20230138154A1

公开(公告)日：2023-05-04

申请号：US17910612

申请日：2021-03-12

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Futa GAKIYA ,  Akiyasu IIOKA ,  Kouichi TSUNODA ,  Kenichi YOSHIDA

IPC: H01L27/01

Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.

公开(公告)号：US20210257164A1

公开(公告)日：2021-08-19

申请号：US17165498

申请日：2021-02-02

Applicant: TDK CORPORATION

Inventor： Masahiro HIRAOKA ,  Mitsuhiro TOMIKAWA ,  Hitoshi SAITA

IPC: H01G4/33 ,  H01G4/008 ,  H01G4/08 ,  H01G4/30 ,  H05K3/38 ,  H05K1/03

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The lower electrode layer includes a first metal layer positioned on a side facing the dielectric layer and a second metal layer positioned on a side facing away from the dielectric layer. The first metal layer has a first surface positioned on a side facing the second metal layer and a second surface positioned on a side facing the dielectric layer. The first surface has a surface roughness higher than that of the second surface. The second metal layer reflects a surface property of the first surface.

公开(公告)号：US20180240599A1

公开(公告)日：2018-08-23

申请号：US15899403

申请日：2018-02-20

Applicant: TDK CORPORATION

Inventor： Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G9/04 ,  H01G9/012 ,  H01G9/07

CPC classification number: H01G4/33 ,  H01G2/02 ,  H01G4/224 ,  H01G4/228 ,  H01G9/012 ,  H01G9/04 ,  H01G9/07 ,  H05K2201/0179 ,  H05K2201/0195

Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.