公开(公告)号：US20180102219A1

公开(公告)日：2018-04-12

申请号：US15725860

申请日：2017-10-05

Applicant: TDK CORPORATION

Inventor： Michihiro KUMAGAE ,  Akifumi KAMIJIMA ,  Norihiko MATSUZAKA ,  Junki NAKAMOTO ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/30 ,  H01G4/33 ,  H01G4/012 ,  H01G4/224

CPC classification number: H01G4/306 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/1254 ,  H01G4/224 ,  H01G4/33

Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.

公开(公告)号：US20240203972A1

公开(公告)日：2024-06-20

申请号：US18589812

申请日：2024-02-28

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Koichi TSUNODA ,  Mitsuhiro TOMIKAWA

IPC: H01L27/01 ,  H01L21/70 ,  H01L23/00

CPC classification number: H01L27/01 ,  H01L21/702 ,  H01L24/05 ,  H01L24/03 ,  H01L2224/03462 ,  H01L2224/05012 ,  H01L2224/05015 ,  H01L2224/05016 ,  H01L2224/05582 ,  H01L2224/05638 ,  H01L2224/05655 ,  H01L2924/01014

Abstract: Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.

公开(公告)号：US20240186056A1

公开(公告)日：2024-06-06

申请号：US18525613

申请日：2023-11-30

Applicant: TDK Corporation

Inventor： Yuuichi KAWAGUCHI ,  Kazuhiro YOSHIKAWA ,  Tomonaga NISHIKAWA ,  Naoaki FUJII ,  Liyi CHEN

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

CPC classification number: H01F27/2804 ,  H01F27/324 ,  H01F41/043 ,  H01F41/12

Abstract: Disclosed herein is a coil component that includes a magnetic element body, a coil pattern and a conductor post embedded in the magnetic element body, a post protective film provided between the conductor post and the magnetic element body, a cover insulating film covering a mounting surface of the magnetic element body, and a terminal electrode provided on the cover insulating film and connected to the conductor post through a first opening formed in the cover insulating film. The terminal electrode includes: a first conductor layer contacting the conductor post through the first opening and having a second opening through which a part of the conductor post is exposed; and a second conductor layer having a resistance value lower than the first conductive material, covering the first conductor layer, and contacting the part of the conductor post through the second opening.

公开(公告)号：US20230138154A1

公开(公告)日：2023-05-04

申请号：US17910612

申请日：2021-03-12

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Futa GAKIYA ,  Akiyasu IIOKA ,  Kouichi TSUNODA ,  Kenichi YOSHIDA

IPC: H01L27/01

Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.

公开(公告)号：US20210219430A1

公开(公告)日：2021-07-15

申请号：US17134316

申请日：2020-12-26

Applicant: TDK CORPORATION

Inventor： Yuichiro OKUYAMA ,  Takeshi OOHASHI ,  Hajime KUWAJIMA ,  Takashi OHTSUKA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/16 ,  H05K1/02

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

公开(公告)号：US20210204406A1

公开(公告)日：2021-07-01

申请号：US17132626

申请日：2020-12-23

Applicant: TDK Corporation

Inventor： Takeshi OOHASHI ,  Shinichiro TODA ,  Daiki KUSUNOKI ,  Takashi OHTSUKA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/16 ,  H01G4/228 ,  H01G4/33 ,  H01G4/40 ,  H01L49/02

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

公开(公告)号：US20190392992A1

公开(公告)日：2019-12-26

申请号：US16436559

申请日：2019-06-10

Applicant: TDK CORPORATION

Inventor： Michihiro KUMAGAE ,  Kazuhiro YOSHIKAWA ,  Shigeaki TANAKA ,  Hitoshi SAITA

IPC: H01G4/33 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H01L49/02

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.

公开(公告)号：US20190287726A1

公开(公告)日：2019-09-19

申请号：US16354373

申请日：2019-03-15

Applicant: TDK Corporation

Inventor： Kazuhiro YOSHIKAWA ,  Daiki ISHII ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/30 ,  H01G4/012 ,  H01G4/06

Abstract: A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1>D2.

公开(公告)号：US20240087787A1

公开(公告)日：2024-03-14

申请号：US18463649

申请日：2023-09-08

Applicant: TDK Corporation

Inventor： Yuki HASHIMOTO ,  Toshiyuki ABE ,  Takeshi OKUMURA ,  Tomonaga NISHIKAWA ,  Naoaki FUJII ,  Kazuhiro YOSHIKAWA

IPC: H01F17/00 ,  H01F17/04 ,  H01F27/02

CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/022 ,  H01F27/292

Abstract: Disclosed herein is a coil component that includes a coil part embedded in a magnetic element body. The coil part has a structure in which plural interlayer insulating films and plural conductor layers having a coil pattern are alternately stacked. At least one of the conductor layers has a clearance area having no coil pattern and extending radially outward from a center axis of the coil part. The magnetic element body includes a first magnetic resin layer provided in an inner diameter area of the coil part, a second magnetic resin layer provided in a radially outside area of the coil part, and a fifth magnetic resin layer filled in the clearance area and contacting the first and second magnetic resin layers.

公开(公告)号：US20210225593A1

公开(公告)日：2021-07-22

申请号：US17143581

申请日：2021-01-07

Applicant: TDK CORPORATION

Inventor： Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA ,  Yuichiro OKUYAMA ,  Takeshi OOHASHI ,  Hajime KUWAJIMA

IPC: H01G4/30 ,  H01G4/08 ,  H01G4/012

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.