公开(公告)号：US20240159591A1

公开(公告)日：2024-05-16

申请号：US18384630

申请日：2023-10-27

申请人： TDK CORPORATION

发明人： Maiko KOKUBO ,  Shinji HARA ,  Naoki OHTA ,  Susumu AOKI ,  Kazuya MAEKAWA ,  Tadao SENRIUCHI ,  Yusuke KIMOTO

IPC分类号： G01J5/02

CPC分类号： G01J5/023 ,  G01J2005/202

摘要： An electromagnetic wave sensor includes: a first wire which extends in a first direction; a second wire which extends in a second direction different from the first direction; and an electromagnetic wave detector which is electrically connected to the first wire and is electrically connected to the second wire, wherein the second wire is provided so as to leave an interval with respect to the first wire in a third direction orthogonal to the first direction and the second direction, and the second wire is disposed to three-dimensionally intersect the first wire. At least one wire of the first wire and the second wire includes a wide portion, which is wider than an average value of a width of a portion excluding an overlapping portion of the at least one wire, in the overlapping portion in which the first wire and the second wire overlap each other.

公开(公告)号：US20210025765A1

公开(公告)日：2021-01-28

申请号：US16969015

申请日：2018-03-06

申请人： TDK Corporation

发明人： Shinji HARA ,  Naoki OHTA ,  Susumu AOKI ,  Eiji KOMURA ,  Akimasa KAIZU

IPC分类号： G01K7/22 ,  H01C7/06

摘要： A heat utilizing device is provided in which the thermal resistance of the wiring layer is increased while an increase in electric resistance of the wiring layer is limited. Heat utilizing device has thermistor whose electric resistance changes depending on temperature; and wiring layer that is connected to thermistor. A mean free path of phonons in wiring layer is smaller than a mean free path of phonons in an infinite medium that consists of a material of wiring layer.

公开(公告)号：US20190285435A1

公开(公告)日：2019-09-19

申请号：US16049981

申请日：2018-07-31

申请人： TDK Corporation

发明人： Naoki OHTA ,  Takayasu KANAYA

IPC分类号： G01D5/16

摘要： The magnetoresistive effect element is provided with a plurality of magnetoresistive effect laminated bodies, a plurality of lower lead electrodes and upper lead electrodes that electrically connect the plurality of magnetoresistive effect laminated bodies in series, and a film that electrically connects the plurality of lower lead electrodes to each other so that none of the plurality of lower lead electrodes is electrically isolated.

公开(公告)号：US20180261760A1

公开(公告)日：2018-09-13

申请号：US15835628

申请日：2017-12-08

申请人： TDK Corporation

发明人： Tetsuya HIRAKI ,  Naoki OHTA ,  Hiraku HIRABAYASHI ,  Yoshiaki TANAKA

IPC分类号： H01L43/02 ,  H01L27/22

CPC分类号： H01L43/02 ,  H01L27/22

摘要： A magnetic sensor is provided which can improve density of magnetoresistance effect elements without narrowing the wiring pitch. A plurality of element array layers 10 are stacked one on another, each of the element array layers including a plurality of magnetoresistance effect elements 1 arranged in parallel in an in-plane direction, and magnetoresistance effect elements 1 in the plurality of element array layers 10 are connected in series to each other.

公开(公告)号：US20180224510A1

公开(公告)日：2018-08-09

申请号：US15679284

申请日：2017-08-17

申请人： TDK Corporation

发明人： Naoki OHTA ,  Keisuke TAKASUGI

IPC分类号： G01R33/09 ,  G01R33/00 ,  G07D7/04

CPC分类号： G01R33/093 ,  G01R33/0011 ,  G01R33/091 ,  G07D7/04 ,  H01L43/08 ,  H01L43/12

摘要： A magnetic sensor having a yoke that can achieve large magnetic flux density and that can be accurately formed is provided. The magnetic sensor includes magnetic field detection element 21 that detects a magnetic field in first direction X and first yoke 23 that is located near magnetic field detection element 21 and extends in second direction Z that is orthogonal to first direction X. First yoke 23 includes first portion 23a that is located away from magnetic field detection element 21 at least in first direction X and second portion 23b that is located farther away from magnetic field detection element 21 than first portion 23a with respect to second direction Z. The second portion 23b has surface 23f that is opposite to interface 23d with the first portion 23a, surface 23f having a curved shape that protrudes in a direction away from the first portion 23a.

公开(公告)号：US20240363268A1

公开(公告)日：2024-10-31

申请号：US18641882

申请日：2024-04-22

申请人： TDK Corporation

发明人： Kazuya MAEKAWA ,  Shinji HARA ,  Naoki OHTA ,  Susumu AOKI ,  Maiko KOKUBO ,  Takahiro NAKAGAWA

IPC分类号： H01C7/00 ,  H01C1/14

CPC分类号： H01C7/008 ,  H01C1/14

摘要： Conductive member 31 comprises a plurality of conductive nitride layers 32 and at least one nitride-metal layer 33 that includes a conductive nitride and a metal. The conductive nitride layers 32 and the at least one nitride-metal layer 33 are alternately stacked. Nitride-metal layer 33 includes metal dispersion layer 33A in which the metal is dispersed in the conductive nitride.

公开(公告)号：US20240280409A1

公开(公告)日：2024-08-22

申请号：US18424957

申请日：2024-01-29

申请人： TDK Corporation

发明人： Susumu AOKI ,  Shinji HARA ,  Naoki OHTA ,  Maiko KOKUBO

IPC分类号： G01J5/02 ,  G01J5/00 ,  G01J5/20

CPC分类号： G01J5/024 ,  G01J2005/0077 ,  G01J2005/202 ,  G01J2005/206

摘要： An electromagnetic wave detection element has: an electromagnetic wave detection portion; a conductive layer that is electrically connected to the electromagnetic wave detection portion; a conductive pillar having an end surface that is electrically connected to the conductive layer, wherein the end surface includes an inner region that is in contact with the conductive layer and an outer region that is positioned outside the inner region; and a dielectric layer that is positioned between at least a part of the outer region and the conductive layer.

公开(公告)号：US20230068352A1

公开(公告)日：2023-03-02

申请号：US17896859

申请日：2022-08-26

申请人： TDK CORPORATION

发明人： Tetsuya HIRAKI ,  Kenzo MAKINO ,  Naoki OHTA

IPC分类号： G01R33/09

摘要： A magnetic sensor includes a first path and a second path, a plurality of structures, and a plurality of first electrodes and a plurality of second electrodes. The first path includes at least one first array. The second path includes at least one second array. The at least one first array and the at least one second array are disposed so that they are arranged in a first direction. The at least one first array and the at least one second array each include an odd number of structures disposed so that they are arranged in a second direction.

公开(公告)号：US20230054724A1

公开(公告)日：2023-02-23

申请号：US17889958

申请日：2022-08-17

申请人： TDK CORPORATION

发明人： Shinji HARA ,  Naoki OHTA ,  Kazuya MAEKAWA ,  Susumu AOKI ,  Maiko SHIROKAWA

IPC分类号： G01J5/20 ,  G01J5/02

摘要： An electromagnetic wave sensor 1 has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each electromagnetic wave absorber at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each electromagnetic wave absorber is away from the second extending portions with the connection portions as fulcrums.

公开(公告)号：US20210020552A1

公开(公告)日：2021-01-21

申请号：US16912952

申请日：2020-06-26

申请人： TDK CORPORATION

发明人： Yosuke KOMASAKI ,  Hiroshi NAGANUMA ,  Naoki OHTA

IPC分类号： H01L23/495 ,  H01L25/03 ,  H01L23/00

摘要： An electronic component package has an outer edge including a first side and a second side adjacent to each other. The electronic component package includes a first electronic component chip, a second electronic component chip provided at a distance from the first electronic component chip, one or more first terminals disposed along the first side, one or more second terminals disposed along the second side, and one or more first conductors. The one or more first conductors couple the one or more first terminals to the first electronic component chip, with the one or more first terminals being uncoupled to the second electronic component chip.