公开(公告)号：US20200315034A1

公开(公告)日：2020-10-01

申请号：US16812671

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Takaaki MORITA ,  Seiichi TAJIMA ,  Takashi KARIYA

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/10

Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

公开(公告)号：US20250149252A1

公开(公告)日：2025-05-08

申请号：US18837696

申请日：2022-12-02

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA ,  Takashi KARIYA ,  Yasunori HARADA ,  Yoshiaki HAYAMIZU ,  Miyu HASEGAWA

IPC: H01G4/33 ,  H01G4/008 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

Abstract: To provide a thin film capacitor having a pair of terminal electrodes capable of being disposed on the same plane. A thin film capacitor includes a metal foil having a roughened surface, a dielectric film covering the roughened surface of the metal foil and having an opening partially exposing the metal foil therethrough, an electrode layer contacting the metal foil through the opening, and an electrode layer contacting the dielectric film without contacting the metal foil. An upper surface position of the electrode layer is equal to or lower in height than that of the electrode layer.