公开(公告)号：US11967444B2

公开(公告)日：2024-04-23

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US10770204B2

公开(公告)日：2020-09-08

申请号：US16611294

申请日：2018-07-12

Applicant: TDK Electronics AG

Inventor： Gerald Kloiber ,  Heinz Strallhofer

IPC: H01C1/144 ,  H01C1/14 ,  H01C17/28 ,  H01R4/02 ,  H01R4/62

Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

公开(公告)号：US12080451B2

公开(公告)日：2024-09-03

申请号：US17887375

申请日：2022-08-12

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

CPC classification number: H01C1/1413 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/029 ,  H01R12/53 ,  H01R43/0221

Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

公开(公告)号：US20220392674A1

公开(公告)日：2022-12-08

申请号：US17887375

申请日：2022-08-12

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

公开(公告)号：US12014852B2

公开(公告)日：2024-06-18

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20220293305A1

公开(公告)日：2022-09-15

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  H01C1/14 ,  G01K7/22 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20240096525A1

公开(公告)日：2024-03-21

申请号：US18524795

申请日：2023-11-30

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside, at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance and at least one top electrode configured for electrically contacting the functional layer from a top side of the functional layer, wherein the top electrode is arranged directly on the functional layer, wherein the top electrode forms the top side of the sensor element, and wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system.

公开(公告)号：US11450457B2

公开(公告)日：2022-09-20

申请号：US16963183

申请日：2019-01-31

Applicant: TDK ELECTRONICS AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).

公开(公告)号：US20200066428A1

公开(公告)日：2020-02-27

申请号：US16611294

申请日：2018-07-12

Applicant: TDK Electronics AG

Inventor： Gerald Kloiber ,  Heinz Strallhofer

IPC: H01C1/144 ,  H01C1/14 ,  H01C17/28 ,  H01R4/02 ,  H01R4/62

Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.