公开(公告)号：US20230415198A1

公开(公告)日：2023-12-28

申请号：US18035892

申请日：2021-11-08

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Cyril KARUTHEDATH ,  Abhilash THANNIYIL ,  Teuvo SILLANPÄÄ ,  Tuomas PENSALA

IPC: B06B1/06

CPC classification number: B06B1/0666

Abstract: There is provided an ultrasonic transducer configured to provide passive temperature compensation for a stable operation over a wide bandwidth. The ultrasonic transducer comprises a cavity for communications of ultrasonic waves and a membrane supported movable between walls of the cavity. The membrane comprises a structural layer on a side of the membrane towards the cavity and a piezoelectric layer attached to the structural layer on an opposite side of the membrane with respect to the cavity. Temperature coefficients of Young's modulus of the structural layer and the piezoelectric layer have opposite signs for passive temperature compensation of operating frequency of the piezoelectric ultrasonic transducer.

公开(公告)号：US20190173451A1

公开(公告)日：2019-06-06

申请号：US16314125

申请日：2017-06-29

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Antti JAAKKOLA ,  Tuomas PENSALA ,  Aarne OJA ,  Panu PEKKO ,  James R DEKKER

IPC: H03H9/02 ,  H03H9/24 ,  H03H3/007

Abstract: The present disclosure describes micromechanical resonator, a resonator element for the resonator, and a method for trimming the resonator. The resonator comprises a resonator element having a length, a width, and a thickness, where the length and the width define a plane of the resonator element. The resonator element comprises at least two regions (52, 53) in the plane of the resonator element, wherein the at least two regions have different thicknesses.

公开(公告)号：US20190112181A1

公开(公告)日：2019-04-18

申请号：US16090308

申请日：2017-03-31

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Antti JAAKKOLA ,  Tuomas PENSALA ,  Mika PRUNNILA ,  Panu PEKKO ,  Jyrki KIIHAMÄKI ,  Aarne OJA

IPC: B81B3/00 ,  B81C1/00

Abstract: The invention provides a micromechanical device comprising a support structure and a deflecting element connected to the support structure, wherein the deflecting element comprises at least one deformable member adapted to deform extensionally, flexurally or torsionally with respect to a deformation axis for allowing deflection of the deflecting element with respect to the support structure. Further, there are means for statically deflecting the deflecting element or detecting the magnitude of static deflection of the deflecting element. According to the invention, the deformable member is made of silicon doped with an n-type doping agent to a doping concentration of at least 1.1*1020 cm−3. The invention allows for manufacturing micromechanical devices whose mechanical operation is not affected by prevailing temperature conditions.