公开(公告)号：US20240047854A1

公开(公告)日：2024-02-08

申请号：US18266407

申请日：2021-12-03

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Vladimir ERMOLOV ,  Antti LAMMINEN

IPC: H01Q1/22 ,  H01Q21/00 ,  H01Q3/26 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01Q21/0006 ,  H01Q21/0093 ,  H01Q3/26 ,  H01L23/66 ,  H01L2924/1423

Abstract: The present invention relates to a millimeter wave RF antenna array apparatus. The apparatus comprises a single-chip MMIC comprising active circuit elements of the antenna array apparatus. The active circuit elements comprise at least antenna feed circuitry configured to feed antenna elements of the antenna array. The apparatus comprises an interposer fabricated of low-loss RF material, such as glass, low-temperature co-fired ceramic, LTCC, or printed circuit board, PCB. The interposer comprises transmission lines of a RF distribution network and a plurality of antenna elements of the antenna array. The transmission lines of the interposer are coupled to the MMIC for providing RF connections for distributing RF signals to and from the antenna feed circuitry. Area of the interposer that comprises the transmission lines of the RF distribution network and the plurality of antenna elements is collocated with the area of the MMIC that comprises said antenna feed circuitry.

公开(公告)号：US20200158757A1

公开(公告)日：2020-05-21

申请号：US16615239

申请日：2018-05-22

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Vladimir ERMOLOV ,  Antti LAMMINEN ,  Jussi SÄILY ,  Tauno VÄHÄ-HEIKKILÄ ,  Pekka RANTAKARI

IPC: G01R1/24 ,  G01R1/067 ,  G01R21/01 ,  H01P5/107 ,  H01P5/12

Abstract: A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.

公开(公告)号：US20240405444A1

公开(公告)日：2024-12-05

申请号：US18686353

申请日：2022-08-25

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Mikko VARONEN ,  Dristy PARVEG ,  Pekka RANTAKARI ,  Antti LAMMINEN ,  Vladimir ERMOLOV ,  Jussi SÄILY ,  Timo KARTTAAVI

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q3/36 ,  H04B7/06

Abstract: The present invention relates to a modular architecture for transmitting and/or receiving radio frequency (RF) signals using a phased antenna array. A first portion of the RF signal is transmitted/received by a master IC (21) and a second portion of the RF signal is transmitted/received by a plurality of satellite ICs (22). RF distribution between the master IC (21) and the satellite ICs (22) occur over a low-RF-loss interposer (51). The master IC (21) performs upconversion/downconversion between RF signal and a baseband or intermediate frequency signal.

公开(公告)号：US20240192642A1

公开(公告)日：2024-06-13

申请号：US18553331

申请日：2022-02-18

Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Inventor： Vladimir ERMOLOV

IPC: G04F5/14 ,  H03L7/26

CPC classification number: G04F5/14 ,  H03L7/26

Abstract: A frequency reference device comprising a waveguide with a first end and a second end, a signal transmitter module for generating a high-frequency electromagnetic wave in the waveguide, and a signal receiver module for receiving the high-frequency electromagnetic wave in the waveguide. The component comprises a sealed enclosure, and said sealed enclosure is filled with a gas. The waveguide, first and second radiation coupling probes and the signal transmitter module and the signal receiver module are all located within said scaled enclosure.

公开(公告)号：US20180188127A1

公开(公告)日：2018-07-05

申请号：US15736436

申请日：2016-06-14

Applicant: Teknologian Tutkimuskeskus VTT Oy

Inventor： Vladimir ERMOLOV ,  Jaakko SAARILAHTI

IPC: G01L9/00 ,  B81B3/00 ,  B81C1/00 ,  G01L19/06

CPC classification number: G01L9/0047 ,  B81B3/0051 ,  B81B2201/0264 ,  B81C1/00182 ,  G01L9/0042 ,  G01L9/0073 ,  G01L19/0618

Abstract: According to an example aspect of the present invention, there is provided a MEMS capacitive pressure sensor (1), comprising a first electrode (17), a deformable second electrode (18) being electrically insulated from the first electrode (17) by means of a chamber (4) between the first electrode (17) and the second electrode (18), and wherein at least one of the first electrode (17) and the second electrode (18) includes at least one pedestal (5) protruding into the chamber (4). According to another example aspect of the present invention, there is also provided a method for manufacturing a MEMS capacitive pressure sensor (1).