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公开(公告)号:US11955504B2
公开(公告)日:2024-04-09
申请号:US17471158
申请日:2021-09-10
CPC分类号: H01L27/14669 , G01J5/023 , G01J5/024 , G01J5/20 , G01J5/24 , H01L27/14636 , H01L27/14649 , H01L27/14683 , H04N5/33 , H04N25/75 , G01J2005/0077 , G01J2005/202
摘要: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.
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公开(公告)号:US20240339482A1
公开(公告)日:2024-10-10
申请号:US18628607
申请日:2024-04-05
CPC分类号: H01L27/14669 , G01J5/023 , G01J5/024 , G01J5/20 , G01J5/24 , H01L27/14636 , H01L27/14649 , H01L27/14683 , H04N5/33 , H04N25/75 , G01J2005/0077 , G01J2005/202
摘要: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.
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