公开(公告)号：US20130344716A1

公开(公告)日：2013-12-26

申请号：US13919243

申请日：2013-06-17

Applicant: TELLABS OY

Inventor： Alf BJORKLOF ,  Antti HOLMA

IPC: H01R13/04 ,  H01R43/20

CPC classification number: H01R13/04 ,  H01R43/205 ,  H05K3/222 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A method for manufacturing a circuit board system includes attaching (501), to a circuit board, electrical components that constitute together with the circuit board a first functional entity and a second functional entity that are disconnected from each other so that operations of the first and second functional entities are substantially free from mutual interactions. The method includes directing (502) electrical activity, for example testing and/or data loading, to the first functional entity and/or to the second functional entity. Subsequently, the method includes providing (503) at least one galvanic connection between the first and second functional entities by pushing one or more press-fit pins in holes of the circuit board in order to enable the first and second functional entities to co-operate with each other. The method allows functional entity-specific testing, data loading, and other electrical activity after e.g. a soldering process and prior to possible functionality testing (504).

Abstract translation: 一种用于制造电路板系统的方法，包括：将与所述电路板一起构成的第一功能实体和第二功能实体与电路板连接（501），所述第一功能实体和第二功能实体彼此断开连接，使得所述第一和第 第二功能实体基本上没有相互作用。 该方法包括将电活动（例如测试和/或数据加载）引导（502）到第一功能实体和/或第二功能实体。 随后，该方法包括在第一和第二功能实体之间提供（503）至少一个电流连接，通过将一个或多个压配合引脚推入电路板的孔中，以使第一和第二功能实体能够合作 与彼此。 该方法允许功能实体特异性测试，数据加载和其他电活动。 焊接过程和可能的功能测试之前（504）。