PRESSURE-SENSITIVE ADHESIVE STRIP FOR MOISTURE-INSENSITIVE PEELABLE ADHESIVE BONDS
    1.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE STRIP FOR MOISTURE-INSENSITIVE PEELABLE ADHESIVE BONDS 审中-公开
    用于防静电粘性胶粘剂的压敏胶粘带

    公开(公告)号:US20160145471A1

    公开(公告)日:2016-05-26

    申请号:US15009003

    申请日:2016-01-28

    Applicant: TESA SE

    Abstract: A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.

    Abstract translation: 一种分离两个基板的方法,该两个基板与可重新切割的至少单面压敏粘合剂条粘合,所述至少单面压敏粘合剂条至少包括a)断裂伸长率至少为300%的芯层,b)外部载体层,其具有 断裂伸长率不超过120%,并且至少部分地连接到芯层,使得当芯层被拉伸时,其与芯层分离,以及c)至少部分地施加到侧面的第一粘合剂层 所述外部载体层与连接到所述芯层的侧面相对,其中所述芯层沿着所述粘合平面的方向被拉伸,从已经被制成非粘合性的区域开始,直到所述芯层从至少一个 的外部载体层,使得两个基板彼此分离。

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