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1.Packaged multilead semiconductor device with improved jumper connection 失效
Title translation: 包装多个半导体器件与改进的跳线连接公开(公告)号:US3436606A
公开(公告)日:1969-04-01
申请号:US3436606D
申请日:1967-04-03
Applicant: TEXAS INSTRUMENTS INC
Inventor: REED BRUCE S , WINGO DALE T
IPC: H01L23/057 , H01L27/00 , H02B1/04
CPC classification number: H01L23/057 , H01L27/00 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2924/09701 , H01L2924/00014 , H01L2924/00