公开(公告)号：US3404304A

公开(公告)日：1968-10-01

申请号：US36388564

申请日：1964-04-30

Applicant: TEXAS INSTRUMENTS INC

Inventor： BONIN EDWARD L ,  PITTMAN GARY E ,  REED BRUCE S

IPC: H01L33/00

CPC classification number: H01L33/0008 ,  H01L33/00 ,  Y10S148/049 ,  Y10S148/051 ,  Y10S148/106 ,  Y10S148/145 ,  Y10S257/926

公开(公告)号：US3593070A

公开(公告)日：1971-07-13

申请号：US3593070D

申请日：1968-12-17

Applicant: TEXAS INSTRUMENTS INC

Inventor： REED BRUCE S

IPC: H01L21/60 ,  H01L23/36 ,  H01L23/48 ,  H01L29/00 ,  H01L29/06 ,  H01L33/20 ,  H01L33/38 ,  H01L33/40 ,  H01L33/64 ,  H01L1/12 ,  H01L15/00

CPC classification number: H01L33/40 ,  H01L23/36 ,  H01L24/80 ,  H01L24/81 ,  H01L29/00 ,  H01L29/0657 ,  H01L33/20 ,  H01L33/38 ,  H01L33/641 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/351 ,  H01L2924/00

Abstract: A radiant diode assembly s provided with a thermally conductive, electrically nonconductive submount, in combination with a metallic heat sink mounting member, thereby permitting series interconnection of the individual units of a multipl1Diode array. Gold-doped silicon is the preferred submount, having a gold content of about 1016 atoms per cm.3 , a thermal conductviity of about 6 watts per cm. per o k., and an electrical resistivity of about 20,000 ohm-cm. at an operating temperature of about 80*K. to 120*K.

公开(公告)号：US3436606A

公开(公告)日：1969-04-01

申请号：US3436606D

申请日：1967-04-03

Applicant: TEXAS INSTRUMENTS INC

Inventor： REED BRUCE S ,  WINGO DALE T

IPC: H01L23/057 ,  H01L27/00 ,  H02B1/04

CPC classification number: H01L23/057 ,  H01L27/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00