公开(公告)号：US11869839B2

公开(公告)日：2024-01-09

申请号：US17317873

申请日：2021-05-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Benjamin Allen Samples ,  Vivek Kishorechand Arora

IPC: H01L23/522 ,  H01L23/538 ,  H01L23/532 ,  H01L25/07 ,  H01L49/02 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L23/5226 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/53228 ,  H01L24/09 ,  H01L25/072 ,  H01L25/50 ,  H01L28/40 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02381

Abstract: A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.

公开(公告)号：US11031332B2

公开(公告)日：2021-06-08

申请号：US16263110

申请日：2019-01-31

Applicant: Texas Instruments Incorporated

Inventor： Woochan Kim ,  Benjamin Allen Samples ,  Vivek Kishorechand Arora

IPC: H01L23/52 ,  H01L23/522 ,  H01L23/538 ,  H01L23/532 ,  H01L25/07 ,  H01L49/02 ,  H01L23/00 ,  H01L25/00

Abstract: A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.

公开(公告)号：US11158567B2

公开(公告)日：2021-10-26

申请号：US16537517

申请日：2019-08-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Vivek Kishorechand Arora ,  Benjamin Allen Samples

IPC: H01L23/495 ,  H05K7/14 ,  H01L23/34 ,  H01L23/00

Abstract: A package includes a semiconductor die forming a power field effect transistor (FET), a control die, and a first leadframe. The control die is arranged on a first surface of the first leadframe, and the semiconductor die is arranged on an opposing second surface of the first leadframe. The package further includes a second leadframe including a first surface and a second surface opposing the first surface, wherein the semiconductor die is arranged on the first surface of the second leadframe to facilitate heat transfer therethrough. The package also includes mold compound at least partially covering the semiconductor die, the control die, the first leadframe and the second leadframe with the second surface of the second leadframe exposed.

公开(公告)号：US20210280512A1

公开(公告)日：2021-09-09

申请号：US17317873

申请日：2021-05-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Benjamin Allen Samples ,  Vivek Kishorechand Arora

IPC: H01L23/522 ,  H01L23/538 ,  H01L23/532 ,  H01L25/07 ,  H01L49/02 ,  H01L23/00 ,  H01L25/00

Abstract: A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.

公开(公告)号：US20210043551A1

公开(公告)日：2021-02-11

申请号：US16537517

申请日：2019-08-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Vivek Kishorechand Arora ,  Benjamin Allen Samples

IPC: H01L23/495 ,  H01L23/00 ,  H05K7/14 ,  H01L23/34

Abstract: A package includes a semiconductor die forming a power field effect transistor (FET), a control die, and a first leadframe. The control die is arranged on a first surface of the first leadframe, and the semiconductor die is arranged on an opposing second surface of the first leadframe. The package further includes a second leadframe including a first surface and a second surface opposing the first surface, wherein the semiconductor die is arranged on the first surface of the second leadframe to facilitate heat transfer therethrough. The package also includes mold compound at least partially covering the semiconductor die, the control die, the first leadframe and the second leadframe with the second surface of the second leadframe exposed.

公开(公告)号：US20200251415A1

公开(公告)日：2020-08-06

申请号：US16263110

申请日：2019-01-31

Applicant: Texas Instruments Incorporated

Inventor： Woochan Kim ,  Benjamin Allen Samples ,  Vivek Kishorechand Arora

IPC: H01L23/522 ,  H01L23/538 ,  H01L23/532 ,  H01L25/00 ,  H01L25/07 ,  H01L49/02 ,  H01L23/00

Abstract: A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.