公开(公告)号：US12021004B2

公开(公告)日：2024-06-25

申请号：US17510684

申请日：2021-10-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiep Xuan Nguyen ,  Jaimal Mallory Wiliamson ,  Arvin Nono Verdeflor ,  Snehamay Sinha

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L21/4817 ,  H01L21/565 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2924/1616 ,  H01L2924/16251 ,  H01L2924/16724

Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.

公开(公告)号：US20220319950A1

公开(公告)日：2022-10-06

申请号：US17510684

申请日：2021-10-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiep Xuan Nguyen ,  Jaimal Mallory Wiliamson ,  Arvin Nono Verdeflor ,  Snehamay Sinha

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.