公开(公告)号：US20240258210A1

公开(公告)日：2024-08-01

申请号：US18104278

申请日：2023-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bob Lee ,  Kim Hong Lucas Chai

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/858 ,  H01L2224/92247

Abstract: A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The metallic substrate further includes a groove about a perimeter of the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic substrate. The groove straddles the topside and a sidewall of the metallic substrate.