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    LOSSY COMPRESSION TECHNIQUE FOR VIDEO ENCODER BANDWIDTH REDUCTION USING COMPRESSION ERROR DATA
    2.
    发明申请
    LOSSY COMPRESSION TECHNIQUE FOR VIDEO ENCODER BANDWIDTH REDUCTION USING COMPRESSION ERROR DATA 有权

    公开(公告)号：US20130279587A1

    公开(公告)日：2013-10-24

    申请号：US13859994

    申请日：2013-04-10

    Applicant: Texas Instruments Incorporated

    Inventor： Ajit Deepak Gupte ,  Mahesh M. Mehendale ,  Hetul Sanghvi ,  Ajit Venkat Rao

    IPC: H04N7/34

    CPC classification number: H04N19/00763 ,  H04N19/428 ,  H04N19/433 ,  H04N19/593 ,  H04N19/61

    Abstract: A method, system and apparatus of lossy compression technique for video encoder bandwidth reduction using compression error data are disclosed. In one embodiment, a method includes storing an error data from a compression of an original reference data in an off-chip memory, accessing the error data during a motion compensation operation, and performing the motion compensation operation by applying the error data through an algorithm (e.g., determined by the method of storing the error data). The method may include generating a predicted frame in the motion compensation operation using a motion vector and an on-chip video data. In addition, the method may include determining the error data as a difference between a compressed reference data (e.g., is created by compressing the original reference data) and an original reference data (e.g., reconstructed from a prior predicted frame and a decompressed encoder data).

    Methods of testing multiple dies
    3.
    发明授权
    Methods of testing multiple dies 有权

    公开(公告)号：US11320478B2

    公开(公告)日：2022-05-03

    申请号：US16901966

    申请日：2020-06-15

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rubin Ajit Parekhji ,  Mahesh M. Mehendale ,  Vinod Menezes ,  Vipul K. Singhal

    IPC: G01R33/00 ,  G01R31/28 ,  G01R31/3185 ,  G01R1/04 ,  G01R1/067

    Abstract: In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.

    SYSTEMS AND METHODS OF TESTING MULTIPLE DIES
    6.
    发明申请
    SYSTEMS AND METHODS OF TESTING MULTIPLE DIES 审中-公开

    公开(公告)号：US20190154755A1

    公开(公告)日：2019-05-23

    申请号：US16247271

    申请日：2019-01-14

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rubin Ajit Parekhji ,  Mahesh M. Mehendale ,  Vinod Menezes ,  Vipul K. Singhal

    IPC: G01R31/28 ,  G01R1/04 ,  G01R1/067 ,  G01R31/3185

    Abstract: In a method of testing a semiconductor wafer including a scribe line and multiple dies, the method includes implementing a first landing pad on the scribe line, and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip, and applying an ATE resource to the first cluster of dies.

    METHODS OF TESTING MULTIPLE DIES
    10.
    发明申请
    METHODS OF TESTING MULTIPLE DIES 审中-公开

    公开(公告)号：US20200379031A1

    公开(公告)日：2020-12-03

    申请号：US16901966

    申请日：2020-06-15

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Rubin Ajit Parekhji ,  Mahesh M. Mehendale ,  Vinod Menezes ,  Vipul K. Singhal

    IPC: G01R31/28 ,  G01R31/3185 ,  G01R1/04 ,  G01R1/067

    Abstract: In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.

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