公开(公告)号：US20230170282A1

公开(公告)日：2023-06-01

申请号：US17537923

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuntao Xu ,  Min Hui Ma ,  Tiange Xie ,  Rongwei Zhang

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3121 ,  H01L23/49541 ,  H01L24/83 ,  H01L21/56 ,  H01L2224/32245 ,  H01L2224/32013 ,  H01L2224/73265 ,  H01L2224/8385

Abstract: A semiconductor device includes a silicon die having a first side and a second side, an adhesive layer attached to the first side of the silicon die, and a lead frame. The lead frame comprises a die attach pad having a mounting surface. The mounting surface has a smaller area than an area of the adhesive layer. The silicon die is mounted on the lead frame at the mounting surface so that edges of the silicon die and the adhesive layer overhang the die attach pad without touching the die attach pad. The semiconductor device further includes one or more leads that are spaced apart from the edges of the silicon die and the adhesive layer.