公开(公告)号：US20180186625A1

公开(公告)日：2018-07-05

申请号：US15395029

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Simon Joshua JACOBS ,  Molly Nelis SING ,  Kelly Jay TAYLOR

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0075 ,  B81B2207/07 ,  B81C1/0038 ,  B81C2201/0132 ,  B81C2201/0176

Abstract: In described examples, a method of forming a microelectromechanical device comprises: forming a first metallic layer comprising a conducting layer on a substrate; forming a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming a sacrificial layer on the first dielectric layer; forming a second dielectric layer on the sacrificial layer; forming a second metallic layer on the second dielectric layer; and removing the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificial layer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction.

公开(公告)号：US20190127212A1

公开(公告)日：2019-05-02

申请号：US15799808

申请日：2017-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Simon Joshua JACOBS ,  Molly Nelis SING ,  Lawrence Tucker LATHAM

IPC: B81B3/00 ,  B81C1/00

Abstract: In described examples, a MEMS device component includes a passivation layer formed from a vapor and/or a liquid compound that may include precursors. The compound may contain amino acid, antioxidants, nitriles or other compounds, and may be disposed on a surface of the MEMS device component and/or a package or package portion thereof. If the compound is a precursor, it may be treated to cause formation of the passivation layer from the precursor.

公开(公告)号：US20190204587A1

公开(公告)日：2019-07-04

申请号：US16226420

申请日：2018-12-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Robert F. PAYNE ,  Molly Nelis SING

IPC: G02B26/08 ,  G01B7/30

CPC classification number: G02B26/0841 ,  G01B7/30

Abstract: A digital micromirror device includes a plurality of micromirror cells on a semiconductor die. Each respective cell includes a memory circuit and an electrode selection circuit. At least some of the micromirror cells include a micromirror and each respective memory circuit controls a micromirror tilt angle. For a given memory circuit controlled to a first tilt angle, a measurement circuit measures a first value indicative of a capacitance between a first electrode and the micromirror and measures a second value indicative of a capacitance on the second electrode. For a second micromirror tilt angle, the measurement circuit measures a third value indicative of a capacitance between the first electrode and the micromirror and measures a fourth value indicative of a capacitance on the second electrode. The measurement circuit generates a signal indicative of whether the micromirror is stuck at a particular angle or missing.