公开(公告)号：US20250112114A1

公开(公告)日：2025-04-03

申请号：US18479000

申请日：2023-09-30

Applicant: Texas Instruments Incorporated

Inventor： Ninad Shahane ,  Vivek Arora ,  Kwang-Soo Kim

IPC: H01L23/373 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: An example includes: a package substrate having a die pad with a device side surface and a thermal pad on an opposite side surface; a thermal dissipation structure mounted to the die pad, the thermal dissipation structure including a thermally conductive insulator core and thermal conductors on a device side surface and on a substrate mount surface opposite the device side surface; at least one semiconductor device die mounted to the device side surface of the thermal dissipation structure; electrical connections formed between leads on the package substrate and bond pads on the at least one semiconductor device die; and mold compound covering the electrical connections, the at least one semiconductor device, and portions of the package substrate, portions of the leads of the package substrate forming terminals, and the thermal pad exposed from the mold compound and forming a thermal pad for a semiconductor device package.

公开(公告)号：US20230386963A1

公开(公告)日：2023-11-30

申请号：US17828803

申请日：2022-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： WOOCHAN KIM ,  Vivek Kishorechand Arora ,  Ninad Shahane ,  Makoto Shibuya

IPC: H01L23/373 ,  H01L23/66 ,  H01L23/12 ,  H01L23/498 ,  H02M3/155 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/3735 ,  H01L23/66 ,  H01L23/12 ,  H01L23/49811 ,  H02M3/155 ,  H01L25/18 ,  H01L24/48 ,  H01L2924/1033 ,  H01L2224/05567

Abstract: A power converter module includes a substrate having a first surface and a second surface that opposes the first surface. The power converter module includes a thick printed copper (TPC) substrate on the first surface of the substrate. The TPC substrate includes a first layer having TPC patterned on the first surface of the substrate and a second layer with dielectric patterned on the first layer. The TPC substrate includes a third layer having TPC patterned on the second layer. The power converter module includes power transistors mounted on the TPC substrate and a control integrated circuit (IC) chip mounted on the TPC substrate.