公开(公告)号：US11171200B2

公开(公告)日：2021-11-09

申请号：US16584463

申请日：2019-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Poornika Fernandes ,  David Matthew Curran ,  Stephen Arion Meisner ,  Bhaskar Srinivasan ,  Guruvayurappan S. Mathur ,  Scott William Jessen ,  Shih Chang Chang ,  Russell Duane Fields ,  Thomas Terrance Lynch

IPC: H01L49/02 ,  H01L21/02

Abstract: In some examples, an integrated circuit comprises a substrate; a first metal layer and a second metal layer positioned above the substrate; a first composite dielectric layer located on the first metal layer, wherein the first composite dielectric layer comprises a first anti-reflective coating; a second composite dielectric layer positioned on the second metal layer, wherein the second composite dielectric layer comprises a second anti-reflective coating; and a capacitor metal layer disposed over the first composite dielectric layer.