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公开(公告)号：US20140191381A1
公开(公告)日：2014-07-10
申请号：US13737697
申请日：2013-01-09
Applicant: TEXAS INSTRUMENTS INCORPORATED
IPC: H01L23/495 , H01L23/00
CPC classification number: H01L23/49575 , H01L21/56 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49537 , H01L23/49551 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/0401 , H01L2224/08245 , H01L2224/131 , H01L2224/16245 , H01L2224/73251 , H01L2224/80904 , H01L2224/8121 , H01L2224/81815 , H01L2224/92222 , H01L2224/97 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2924/00
Abstract: An integrated circuit module including a generally flat die attachment pad (DAP) positioned substantially in a first plane; and a generally flat lead bar positioned substantially in a second plane above and parallel to said first plane and having at least one downwardly and outwardly extending lead bar lead projecting therefrom and terminating substantially in the first plane; a top leadframe having a plurality of generally flat contact pads positioned substantially in a third plane above and parallel to the second plane and a plurality of leads having proximal end portions connected to the pad portions and having downwardly and outwardly extending distal end portions terminating substantially in said first plane; an IC die connected to the top leadframe, and the DAP; and encapsulation material encapsulating at least portions of the DAP, the lead bar, the top lead frame, and the IC die.
Abstract translation: 一种集成电路模块，包括基本上位于第一平面中的大致平坦的芯片附接焊盘（DAP）; 以及大致平坦的引线条，其基本上位于第二平面的上方并平行于所述第一平面，并且具有至少一个向下和向外延伸的引导杆引线，其从所述第一平面突出并终止于所述第一平面中; 顶部引线框架具有多个基本上平坦的接触焊盘，其基本上位于第三平面中并且平行于第二平面，并且多个引线具有连接到焊盘部分的近端部分，并且具有向下和向外延伸的远端部分，其基本上终止于 第一架飞机 连接到顶部引线框架的IC管芯和DAP; 以及封装材料，其封装DAP，引线条，顶部引线框架和IC管芯的至少一部分。
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公开(公告)号：US09029194B2
公开(公告)日：2015-05-12
申请号：US14267565
申请日：2014-05-01
Applicant: Texas Instruments Incorporated
CPC classification number: H01L23/49575 , H01L21/56 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49537 , H01L23/49551 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/0401 , H01L2224/08245 , H01L2224/131 , H01L2224/16245 , H01L2224/73251 , H01L2224/80904 , H01L2224/8121 , H01L2224/81815 , H01L2224/92222 , H01L2224/97 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2924/00
Abstract: A method of making an integrated circuit module starts with a top leadframe strip comprising a plurality of integrally connected top leadframes. A plurality of flipchip dies are mounted on the top leadframe strip with solder bumps of each flipchip bonded to predetermined pad portions on each of the top leadframes. The top leadframe strip is attached to a bottom leadframe strip. The bottom leadframe strip has a plurality of integrally connected bottom leadframes each having a central die attach pad (DAP) portion and a peripheral frame portion. A back face of each flipchip die contacts the DAP portion of each bottom leadframe. Lead portions of each top leadframe are attached to the peripheral frame portion of each bottom leadframe. The top leadframe strip is attached to the bottom leadframe strip with a back face of each flipchip die contacting the DAP portion of each bottom leadframe and with lead portions of each top leadframe attached to the peripheral frame portion of each bottom leadframe.
Abstract translation: 制造集成电路模块的方法从包括多个整体连接的顶部引线框架的顶部引线框条开始。 多个倒装芯片模具安装在顶部引线框架条上，每个倒装芯片的焊料凸块接合到每个顶部引线框架上的预定焊盘部分。 顶部引线框条连接到底部引线框条。 底部引线框带具有多个整体连接的底部引线框架，每个底部引线框架具有中央管芯附接焊盘（DAP）部分和外围框架部分。 每个倒装芯片模具的背面接触每个底部引线框架的DAP部分。 每个顶部引线框架的引线部分附接到每个底部引线框架的外围框架部分。 顶部引线框条附接到底部引线框条，每个倒装芯片模具的背面接触每个底部引线框架的DAP部分，并且每个顶部引线框架的引线部分连接到每个底部引线框架的外围框架部分。
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公开(公告)号：US08884414B2
公开(公告)日：2014-11-11
申请号：US13737697
申请日：2013-01-09
Applicant: Texas Instruments Incorporated
IPC: H01L23/495 , H01L23/34 , H01L23/00
CPC classification number: H01L23/49575 , H01L21/56 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49537 , H01L23/49551 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/0401 , H01L2224/08245 , H01L2224/131 , H01L2224/16245 , H01L2224/73251 , H01L2224/80904 , H01L2224/8121 , H01L2224/81815 , H01L2224/92222 , H01L2224/97 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2924/00
Abstract: An integrated circuit module including a generally flat die attachment pad (DAP) positioned substantially in a first plane; and a generally flat lead bar positioned substantially in a second plane above and parallel to said first plane and having at least one downwardly and outwardly extending lead bar lead projecting therefrom and terminating substantially in the first plane; a top leadframe having a plurality of generally flat contact pads positioned substantially in a third plane above and parallel to the second plane and a plurality of leads having proximal end portions connected to the pad portions and having downwardly and outwardly extending distal end portions terminating substantially in said first plane; an IC die connected to the top leadframe, and the DAP; and encapsulation material encapsulating at least portions of the DAP, the lead bar, the top lead frame, and the IC die.
Abstract translation: 一种集成电路模块，包括基本上位于第一平面中的大致平坦的芯片附接焊盘（DAP）; 以及大致平坦的引线条，其基本上位于第二平面的上方并平行于所述第一平面，并且具有至少一个向下和向外延伸的引导杆引线，其从所述第一平面突出并基本上终止在所述第一平面内; 顶部引线框架具有多个基本上平坦的接触焊盘，其基本上位于第三平面中并且平行于第二平面，并且多个引线具有连接到焊盘部分的近端部分，并且具有向下和向外延伸的远端部分，其基本上终止于 第一架飞机 连接到顶部引线框架的IC管芯和DAP; 以及封装材料，其封装DAP，引线条，顶部引线框架和IC管芯的至少一部分。
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公开(公告)号：US20140242755A1
公开(公告)日：2014-08-28
申请号：US14267565
申请日：2014-05-01
Applicant: Texas Instruments Incorporated
CPC classification number: H01L23/49575 , H01L21/56 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49537 , H01L23/49551 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/0401 , H01L2224/08245 , H01L2224/131 , H01L2224/16245 , H01L2224/73251 , H01L2224/80904 , H01L2224/8121 , H01L2224/81815 , H01L2224/92222 , H01L2224/97 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2924/00
Abstract: A method of making an integrated circuit module starts with a top leadframe strip comprising a plurality of integrally connected top leadframes. A plurality of flipchip dies are mounted on the top leadframe strip with solder bumps of each flipchip bonded to predetermined pad portions on each of the top leadframes. The top leadframe strip is attached to a bottom leadframe strip. The bottom leadframe strip has a plurality of integrally connected bottom leadframes each having a central die attach pad (DAP) portion and a peripheral frame portion. A back face of each flipchip die contacts the DAP portion of each bottom leadframe. Lead portions of each top leadframe are attached to the peripheral frame portion of each bottom leadframe. The top leadframe strip is attached to the bottom leadframe strip with a back face of each flipchip die contacting the DAP portion of each bottom leadframe and with lead portions of each top leadframe attached to the peripheral frame portion of each bottom leadframe.
Abstract translation: 制造集成电路模块的方法从包括多个整体连接的顶部引线框架的顶部引线框条开始。 多个倒装芯片模具安装在顶部引线框架条上，每个倒装芯片的焊料凸块接合到每个顶部引线框架上的预定焊盘部分。 顶部引线框条连接到底部引线框条。 底部引线框带具有多个整体连接的底部引线框架，每个底部引线框架具有中央管芯附接焊盘（DAP）部分和外围框架部分。 每个倒装芯片模具的背面接触每个底部引线框架的DAP部分。 每个顶部引线框架的引线部分附接到每个底部引线框架的外围框架部分。 顶部引线框条附接到底部引线框条，每个倒装芯片模具的背面接触每个底部引线框架的DAP部分，并且每个顶部引线框架的引线部分连接到每个底部引线框架的外围框架部分。
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