公开(公告)号：US20240071892A1

公开(公告)日：2024-02-29

申请号：US17900446

申请日：2022-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kwang-Soo KIM ,  Vivek ARORA ,  Woochan KIM

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48245 ,  H01L2224/48464 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182

Abstract: In examples, a method of manufacturing a semiconductor package comprises providing a lead frame having multiple conductive pins coupled thereto; positioning the lead frame within a mold chase and applying a strip of mold compound to the multiple conductive pins along a length of the lead frame; trimming connections between the lead frame and the multiple conductive pins; bending the multiple conductive pins; trimming the strip of mold compound to singulate the multiple conductive pins from each other and from the lead frame to form singulated conductive pins; coupling a singulated conductive pin from among the singulated conductive pins to a substrate such that a portion of the strip of mold compound coupled to the singulated conductive pin is in contact with the substrate and such that a segment of the singulated conductive pin extends vertically in a plane that is orthogonal to the substrate; coupling a semiconductor die to the substrate; and covering the substrate, the semiconductor die, the portion of the strip of mold compound, and part of the singulated conductive pin with a second mold compound, such that a portion of the segment of the singulated conductive pin extends beyond a top surface of the second mold compound.