公开(公告)号：US20250079258A1

公开(公告)日：2025-03-06

申请号：US18459198

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan KIM ,  Ashok PRABHU

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/065

Abstract: In examples, a package comprises a substrate including a conductive member coupled to a conductive terminal, with the conductive terminal exposed to an exterior of the package. The package also includes a first semiconductor die having first device and first non-device sides, with the first device side coupled to the substrate and the first non-device side opposing the first device side, and with the first device side having circuitry formed therein. The package also includes a second semiconductor die having second device and second non-device sides, with the second device side coupled to the substrate and the second non-device side opposing the second device side, and with the second device side having circuitry formed therein. The package also includes first and second adhesive layers contacting the first and second non-device sides, respectively. The package also includes a passivation overcoat (PO) layer contacting the first and second adhesive layers, and a semiconductor layer contacting the PO layer and exposed to an exterior of the package.

公开(公告)号：US20240071892A1

公开(公告)日：2024-02-29

申请号：US17900446

申请日：2022-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kwang-Soo KIM ,  Vivek ARORA ,  Woochan KIM

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48245 ,  H01L2224/48464 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182

Abstract: In examples, a method of manufacturing a semiconductor package comprises providing a lead frame having multiple conductive pins coupled thereto; positioning the lead frame within a mold chase and applying a strip of mold compound to the multiple conductive pins along a length of the lead frame; trimming connections between the lead frame and the multiple conductive pins; bending the multiple conductive pins; trimming the strip of mold compound to singulate the multiple conductive pins from each other and from the lead frame to form singulated conductive pins; coupling a singulated conductive pin from among the singulated conductive pins to a substrate such that a portion of the strip of mold compound coupled to the singulated conductive pin is in contact with the substrate and such that a segment of the singulated conductive pin extends vertically in a plane that is orthogonal to the substrate; coupling a semiconductor die to the substrate; and covering the substrate, the semiconductor die, the portion of the strip of mold compound, and part of the singulated conductive pin with a second mold compound, such that a portion of the segment of the singulated conductive pin extends beyond a top surface of the second mold compound.