Abstract:
A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.
Abstract:
A method for calibrating an inertial angular sensor, includes the steps of: A for at least two electrical angles (θj) of the vibration wave: A1 applying, via each of the three trim controls CTi, a sinusoidal stiffness disturbance PSi having a disturbance frequency fi, and for each applied disturbance: A11 determining and storing an estimated excitation force Fei to be applied to the resonator in the presence of said disturbance PSi, on the basis of excitation controls determined by the servo controls, B determining, on the basis of the three estimated excitation forces Fei i=1, 2, 3 stored in step A11, three 2×2 matrices M′i, a matrix M′i being representative of the response of the gyrometer to the disturbance PSi, C determining and storing an estimated inverse excitation matrix (formula (A)) and an estimated inverse detection matrix (formula (B)) on the basis of the three matrices M′i determined in step B, an excitation matrix E and a detection matrix D being respectively representative of the effects of the excitation chain and of the effect of the detection chain of the sensor.
Abstract:
The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane.The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.
Abstract:
A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.