公开(公告)号：US20160023406A1

公开(公告)日：2016-01-28

申请号：US14340914

申请日：2014-07-25

Applicant: THE BOEING COMPANY

Inventor： Moushumi Shome ,  Sahrudine Apdalhaliem ,  Frederick T. Calkins ,  Waeil M. Ashmawi ,  Kimberly Meredith

IPC: B29C70/34 ,  B32B37/10 ,  B32B37/18 ,  B29C70/54 ,  B32B37/00

CPC classification number: B32B37/1036 ,  B29C33/38 ,  B29C33/485 ,  B29C70/446 ,  B29C70/54 ,  B29K2905/00 ,  B29L2031/3076 ,  B32B37/0046 ,  B32B37/18 ,  B32B2605/18 ,  Y02T50/43

Abstract: In one or more aspects of the present disclosure, a mandrel is disclosed. The mandrel having a shape memory alloy (SMA) shell having a longitudinal axis, an interior extending along the longitudinal axis and an exterior contour, the SMA shell being configured to interface with a structure to be cured, and at least one SMA actuation member disposed within the interior and connected to the SMA shell, where the at least one SMA actuation member is configured to exert pressure against the SMA shell effecting an interface pressure between the exterior contour of the SMA shell and the structure to be cured where the exterior contour has a predetermined actuated shape that corresponds to a predetermined cured shape of the structure to be cured.

Abstract translation: 在本公开的一个或多个方面，公开了一种心轴。 心轴具有具有纵向轴线的形状记忆合金（SMA）壳体，沿着纵向轴线延伸的内部和外部轮廓，SMA壳体被配置为与要固化的结构相接触，并且至少一个SMA致动构件设置在 在内部并且连接到SMA壳体，其中至少一个SMA致动构件构造成对SMA壳施加压力，从而影响SMA外壳的外部轮廓与外部轮廓具有的待固化结构之间的界面压力 对应于要固化的结构的预定固化形状的预定的致动形状。

公开(公告)号：US09919505B2

公开(公告)日：2018-03-20

申请号：US14340914

申请日：2014-07-25

Applicant: THE BOEING COMPANY

Inventor： Moushumi Shome ,  Sahrudine Apdalhaliem ,  Frederick T. Calkins ,  Waeil M. Ashmawi ,  Kimberly Meredith

IPC: B29C70/34 ,  B29C70/54 ,  B32B37/00 ,  B32B37/10 ,  B32B37/18 ,  B29C33/38 ,  B29C33/48 ,  B29C70/44 ,  B29L31/30

CPC classification number: B32B37/1036 ,  B29C33/38 ,  B29C33/485 ,  B29C70/446 ,  B29C70/54 ,  B29K2905/00 ,  B29L2031/3076 ,  B32B37/0046 ,  B32B37/18 ,  B32B2605/18 ,  Y02T50/43

Abstract: In one or more aspects of the present disclosure, a mandrel is disclosed. The mandrel having a shape memory alloy (SMA) shell having a longitudinal axis, an interior extending along the longitudinal axis and an exterior contour, the SMA shell being configured to interface with a structure to be cured, and at least one SMA actuation member disposed within the interior and connected to the SMA shell, where the at least one SMA actuation member is configured to exert pressure against the SMA shell effecting an interface pressure between the exterior contour of the SMA shell and the structure to be cured where the exterior contour has a predetermined actuated shape that corresponds to a predetermined cured shape of the structure to be cured.

公开(公告)号：US20160325490A1

公开(公告)日：2016-11-10

申请号：US14708158

申请日：2015-05-08

Applicant: The Boeing Company

Inventor： Morteza Safai ,  Kimberly Meredith

IPC: B29C65/00 ,  B29C65/08 ,  B29C65/48

CPC classification number: B29C66/721 ,  B29C35/0261 ,  B29C65/08 ,  B29C65/088 ,  B29C65/4835 ,  B29C65/5028 ,  B29C65/5057 ,  B29C65/8292 ,  B29C66/1222 ,  B29C66/1226 ,  B29C66/472 ,  B29C66/474 ,  B29C66/5326 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/73941 ,  B29C66/81422 ,  B29C66/836 ,  B29C66/8412 ,  B29C66/86533 ,  B29C66/9121 ,  B29C66/91216 ,  B29C66/9141 ,  B29C66/91411 ,  B29C66/91951 ,  B29C66/951 ,  B29C66/9512 ,  B29C66/9516 ,  B29C66/961 ,  B29C66/9674 ,  B29C73/10 ,  B29C73/12 ,  B29C73/14 ,  B29C73/34 ,  B29L2031/10 ,  B29L2031/30 ,  B29L2031/3055 ,  B29L2031/3067 ,  B29L2031/3076 ,  B29L2031/3082 ,  B29L2031/3091 ,  B29L2031/7126 ,  B29L2031/7692 ,  B29K2307/04 ,  B29K2063/00

Abstract: A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.

Abstract translation: 接合材料的方法可以包括在物体表面上的固化区域中限定两种材料之间的键合界面，并加热与声波的键合界面。 加热接合界面可以包括对结合界面施加超声波。

公开(公告)号：US10213964B2

公开(公告)日：2019-02-26

申请号：US14708158

申请日：2015-05-08

Applicant: The Boeing Company

Inventor： Morteza Safai ,  Kimberly Meredith

IPC: B29C65/08 ,  B29C65/00 ,  B29C65/48 ,  B29C73/10 ,  B29C73/12 ,  B29C73/34 ,  B29C35/02 ,  B29L31/30 ,  B29L31/00 ,  B29C65/50 ,  B29C73/14 ,  B29C65/82 ,  B29L31/10

Abstract: A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.