公开(公告)号：US20190151995A1

公开(公告)日：2019-05-23

申请号：US16239146

申请日：2019-01-03

Applicant: THE BOEING COMPANY

Inventor： Nick S. Evans ,  Bradley J. Mitchell ,  Mark Blumenkrantz

IPC: B23K26/364 ,  B23K26/38 ,  B23K26/08 ,  B23K26/12 ,  B23K26/06

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

公开(公告)号：US10239159B2

公开(公告)日：2019-03-26

申请号：US15199896

申请日：2016-06-30

Applicant: THE BOEING COMPANY

Inventor： Nick S. Evans ,  Bradley J. Mitchell ,  Mark Blumenkrantz

IPC: B23K26/02 ,  B23K26/364 ,  B23K26/351 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  B23K26/38 ,  B23K101/32 ,  B23K101/38 ,  B23K101/34

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

公开(公告)号：US10065206B2

公开(公告)日：2018-09-04

申请号：US14703779

申请日：2015-05-04

Applicant: The Boeing Company

Inventor： Solomon Atsebha ,  Mark Blumenkrantz ,  John Walter Pringle, IV

IPC: B05B1/00 ,  B05C5/02 ,  B05C17/005 ,  B05B13/02

Abstract: Systems, apparatuses, and methods for applying viscous fluid to a component having a primary surface and opposed surfaces perpendicular to the primary surface may include positioning an adjustable nozzle adjacent the primary surface such that first and second contact members of the nozzle, movable relative to each other, contact the opposed surfaces, the first and second contact members being urged toward the opposed surfaces by at least one biasing element of the adjustable nozzle, applying a viscous fluid from a passage in a body of the adjustable nozzle to the primary surface, and moving the adjustable nozzle along the primary surface.

公开(公告)号：US20160325307A1

公开(公告)日：2016-11-10

申请号：US14703779

申请日：2015-05-04

Applicant: The Boeing Company

Inventor： Solomon Atsebha ,  Mark Blumenkrantz ,  John Walter Pringle, IV

IPC: B05D1/02 ,  B05B1/00

CPC classification number: B05C5/0212 ,  B05B13/0207 ,  B05B13/0278 ,  B05C5/0204 ,  B05C17/00589

Abstract: Systems, apparatuses, and methods for applying viscous fluid to a component having a primary surface and opposed surfaces perpendicular to the primary surface may include positioning an adjustable nozzle adjacent the primary surface such that first and second contact members of the nozzle, movable relative to each other, contact the opposed surfaces, the first and second contact members being urged toward the opposed surfaces by at least one biasing element of the adjustable nozzle, applying a viscous fluid from a passage in a body of the adjustable nozzle to the primary surface, and moving the adjustable nozzle along the primary surface.

Abstract translation: 将粘性流体施加到具有主表面的部件和垂直于主表面的相对表面的部件的系统，装置和方法可以包括将可调节喷嘴定位在主表面附近，使得喷嘴的第一和第二接触部件相对于每个表面可移动 另一方面，接触相对表面，第一和第二接触构件被可调节喷嘴的至少一个偏压元件推向相对表面，将可调节喷嘴的主体中的通道的粘性流体施加到主表面，以及 沿着主表面移动可调喷嘴。

公开(公告)号：US11446768B2

公开(公告)日：2022-09-20

申请号：US16239146

申请日：2019-01-03

Applicant: THE BOEING COMPANY

Inventor： Nick S. Evans ,  Bradley J. Mitchell ,  Mark Blumenkrantz

IPC: B23K26/364 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  B23K26/38 ,  B23K101/32 ,  B23K101/38 ,  B23K101/34

Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.