Electric field sensor with electrode interleaving vibration
    2.
    发明授权
    Electric field sensor with electrode interleaving vibration 有权
    电场传感器具有电极交错振动

    公开(公告)号:US08339131B2

    公开(公告)日:2012-12-25

    申请号:US12501721

    申请日:2009-07-13

    IPC分类号: G01R33/02

    摘要: An electric field sensor comprising: a substrate having a hole; a shielding electrode and a sensing electrode, disposed in the hole of the substrate; a piezoelectric bar having one end connected to the center of the shielding electrode, the other end fixed on the substrate. Present invention provides several electric field sensors, which have the same feature of utilizing electrodes interleaving vibration to modulate external electric field. They have IC-compatible operation voltage and small volume.

    摘要翻译: 一种电场传感器,包括:具有孔的基板; 屏蔽电极和感测电极,设置在基板的孔中; 一个压电棒,其一端连接到屏蔽电极的中心,另一端固定在基板上。 本发明提供了几种电场传感器,其具有利用电极交织振动来调制外部电场的相同特征。 它们具有IC兼容的工作电压和小体积。

    Electric field sensor with electrode interleaving vibration
    3.
    发明申请
    Electric field sensor with electrode interleaving vibration 审中-公开
    电场传感器具有电极交错振动

    公开(公告)号:US20060279271A1

    公开(公告)日:2006-12-14

    申请号:US11446781

    申请日:2006-06-05

    IPC分类号: G01N27/00

    摘要: An electric field sensor comprising: a substrate having a hole; a shielding electrode and a sensing electrode, disposed in the hole of the substrate; a piezoelectric bar having one end connected to the center of the shielding electrode, the other end fixed on the substrate. Present invention provides several electric field sensors, which have the same feature of utilizing electrodes interleaving vibration to modulate external electric field. They have IC-compatible operation voltage and small volume.

    摘要翻译: 一种电场传感器,包括:具有孔的基板; 屏蔽电极和感测电极,设置在基板的孔中; 一个压电棒,其一端连接到屏蔽电极的中心,另一端固定在基板上。 本发明提供了几种电场传感器,其具有利用电极交织振动来调制外部电场的相同特征。 它们具有IC兼容的工作电压和小体积。

    Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
    4.
    发明授权
    Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck 失效
    在基板支撑卡盘上制造晶片间隔掩模的方法和装置

    公开(公告)号:US06623605B2

    公开(公告)日:2003-09-23

    申请号:US10006423

    申请日:2001-12-06

    IPC分类号: C23C1434

    摘要: A method and apparatus for fabricating a wafer spacing mask and a substrate support chuck. Such apparatus is a stencil containing a plurality of dual counterbored apertures that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures' openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.

    摘要翻译: 一种用于制造晶片间隔掩模和基板支撑卡盘的方法和装置。 这种装置是一种模板,其包含多个双重沉孔,其位于基板支撑卡盘的顶部,同时材料沉积在模版上并通过孔的开口到卡盘上。 在沉积工艺完成后,将模板从工件支撑卡盘上移除,留下各种宽度但相同高度的材料沉积物以形成晶片间隔掩模。