公开(公告)号：US20220310885A1

公开(公告)日：2022-09-29

申请号：US16757390

申请日：2020-03-24

Applicant: TLC CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Hongquan WEI

IPC: H01L33/50 ,  C09J11/04 ,  C09J133/08 ,  C09J163/00 ,  C09J183/04 ,  H01L33/54 ,  C09J11/06

Abstract: The present disclosure provides an encapsulated fluorescent adhesive layer, a method for manufacturing the same, and a quantum dot backlight. The quantum dot backlight includes a substrate, a light emitting chip, and the encapsulated fluorescent adhesive layer. The encapsulated fluorescent adhesive layer is used for heat transfer and heat dissipation.