公开(公告)号：US09643396B2

公开(公告)日：2017-05-09

申请号：US14723778

申请日：2015-05-28

申请人： TOKYO ELECTRON LIMITED

发明人： Masaru Honda ,  Ryoichi Sakamoto ,  Katsuhiro Ikeda

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B2309/16 ,  B32B2457/14 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1944 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.