公开(公告)号：US11257701B2

公开(公告)日：2022-02-22

申请号：US16592976

申请日：2019-10-04

Applicant: Tokyo Electron Limited

Inventor： Hidekazu Kiyama ,  Takehiro Kadokura ,  Kazutoshi Ishimaru ,  Takashige Suematsu

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate processing apparatus includes a transfer device configured to transfer at least one substrate as a processing target; a transfer controller configured to control the transfer device to perform a normal transfer of transferring the substrate and a high-accuracy transfer of transferring the substrate with higher positioning accuracy as compared to the normal transfer; a warm-up controller configured to control the transfer device to perform a warm-up operation, which is different from the normal transfer and the high-accuracy transfer, when necessary; and a necessity determination unit configured to make a determination that the warm-up operation is required as a beginning of the high-accuracy transfer is approaching when a duration of a stop state of the transfer device exceeds a preset reference time.

公开(公告)号：US20180240695A1

公开(公告)日：2018-08-23

申请号：US15901954

申请日：2018-02-22

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Hiroki Harada ,  Akihiro Teramoto ,  Tooru Tokimatu ,  Masahiro Abe ,  Kazutoshi Ishimaru

IPC: H01L21/677 ,  G03F7/16 ,  G03F7/20 ,  B65G43/08 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67706 ,  B65G43/08 ,  G03F7/162 ,  G03F7/70733 ,  H01L21/67051 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/68707

Abstract: A device includes a substrate holding unit 25 configured to hold a substrate and be movable in a transversal direction to transfer the substrate from one module to another module; a first detecting unit 3 configured to detect a position of the substrate on the substrate holding unit 25 before the substrate holding unit 25 transfers the substrate into the another module after receiving the substrate from the one module; second detecting units 55 and 56 configured to detect a position deviation between a position of the substrate holding unit 25, which is located at a temporary position set to transfer the substrate into the another module, and the temporary position; and a position determining unit 10 configured to determine a transfer position where the substrate is transferred into the another module based on the position of the substrate on the substrate holding unit 25 and the position deviation.

公开(公告)号：US10424502B2

公开(公告)日：2019-09-24

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Matsunaga ,  Takahiro Masunaga ,  Takashi Koga ,  Yasuharu Iwashita ,  Shingo Katsuki ,  Masaaki Umitsuki ,  Kazutoshi Ishimaru ,  Fumio Sakata

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B29C65/78 ,  H01L21/687

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.