公开(公告)号：US20240006214A1

公开(公告)日：2024-01-04

申请号：US18345100

申请日：2023-06-30

Applicant: Tokyo Electron Limited

Inventor： Shingo Katsuki ,  Kenichirou Matsuyama ,  Sho Kano ,  Saori Kosaki

IPC: H01L21/677 ,  H01L21/67 ,  B65G47/90

CPC classification number: H01L21/67727 ,  H01L21/67173 ,  B65G47/90

Abstract: A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of the pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, a post-stage transfer mechanism. The substrate transfer method includes comparing an exposure apparatus cycle time with a section transfer time required to transfer the substrate from a transfer section by the second transfer mechanism to a transfer section by the post-stage transfer mechanism; and setting the section transfer time based on a result of the comparing.

公开(公告)号：US10424502B2

公开(公告)日：2019-09-24

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Matsunaga ,  Takahiro Masunaga ,  Takashi Koga ,  Yasuharu Iwashita ,  Shingo Katsuki ,  Masaaki Umitsuki ,  Kazutoshi Ishimaru ,  Fumio Sakata

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B29C65/78 ,  H01L21/687

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.