公开(公告)号：US11538668B2

公开(公告)日：2022-12-27

申请号：US16642542

申请日：2019-05-29

Applicant: Tokyo Electron Limited

Inventor： Yasuharu Sasaki ,  Kyo Tsuboi ,  Tomoya Kato ,  Shoichiro Matsuyama

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: Provided is a mounting stage on which a substrate to be subjected to a plasma process is mounted. The mounting stage includes: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring. A groove is provided in at least one of the edge ring and the mounting stage, and the groove is not in communication with the supply holes.

公开(公告)号：US11715630B2

公开(公告)日：2023-08-01

申请号：US16409347

申请日：2019-05-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yusuke Hayasaka ,  Shuhei Yamabe ,  Naoki Tamaru ,  Keisuke Yoshimura ,  Kyo Tsuboi

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/32522 ,  H01J37/32495 ,  H01J37/32715 ,  H01J37/32743 ,  H01J37/32834 ,  H01L21/67069 ,  H01J2237/002 ,  H01J2237/334

Abstract: A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.