公开(公告)号：US10328546B2

公开(公告)日：2019-06-25

申请号：US15499402

申请日：2017-04-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro Kubo ,  Masahiro Fukuda ,  Taro Yamamoto ,  Kenji Yada ,  Masashi Enomoto ,  Noboru Nakashima

IPC: B24D7/18 ,  B24B25/00 ,  B24B27/00 ,  B24B37/34 ,  B24B47/16 ,  B24B49/16 ,  H01L21/02 ,  H01L21/67 ,  B24B37/005 ,  H01L21/306

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

公开(公告)号：US09669510B2

公开(公告)日：2017-06-06

申请号：US14533133

申请日：2014-11-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro Kubo ,  Masahiro Fukuda ,  Taro Yamamoto ,  Kenji Yada ,  Masashi Enomoto ,  Noboru Nakashima

IPC: B24B27/00 ,  B24B37/005 ,  B24B37/34 ,  B24B47/16 ,  B24B25/00 ,  B24D7/18

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.