公开(公告)号：US11268168B2

公开(公告)日：2022-03-08

申请号：US16641146

申请日：2018-08-09

Applicant: TOKYO INSTITUTE OF TECHNOLOGY ,  TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hideki Hosoda ,  Akira Umise ,  Kenji Goto

IPC: C22C5/02 ,  B21D22/02 ,  B22D7/00 ,  C22C1/02 ,  C22F1/14

Abstract: The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of −24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.

公开(公告)号：US12104236B2

公开(公告)日：2024-10-01

申请号：US16968764

申请日：2019-02-28

Applicant: TOKYO INSTITUTE OF TECHNOLOGY ,  TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hideki Hosoda ,  Akira Umise ,  Kenji Goto

IPC: C22F1/00 ,  A61L27/04 ,  A61L27/50 ,  A61L29/02 ,  A61L29/14 ,  A61L31/02 ,  A61L31/14 ,  C22C5/02 ,  C22F1/14

CPC classification number: C22F1/006 ,  A61L27/047 ,  A61L27/50 ,  A61L29/02 ,  A61L29/14 ,  A61L31/022 ,  A61L31/14 ,  C22C5/02 ,  C22F1/14 ,  A61L2400/16 ,  A61L2430/12

Abstract: The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.

公开(公告)号：US10590519B2

公开(公告)日：2020-03-17

申请号：US14913810

申请日：2014-08-29

Applicant: Tanaka Kikinzoku Kogyo K.K. ,  Tokyo Institute Of Technology

Inventor： Hideki Hosada ,  Tomonari Inamura ,  Masaki Tahara ,  Tomohiko Morita ,  Akira Umise ,  Yusuke Doi ,  Kenji Goto

IPC: C22C5/02 ,  C22F1/14 ,  B22D21/00 ,  C22C1/02

Abstract: The present invention provides a superelastic alloy formed by addition of Fe or Co to an Au—Cu—Al alloy, including: Cu of 12.5% by mass or more and 16.5% by mass or less; Al of 3.0% by mass or more and 5.5% by mass or less; Fe or Co of 0.01% by mass or more and 2.0% by mass or less; and a balance Au, and a difference between Al content and Cu content (Cu—Al) is 12% by mass or less. The superelastic alloy according to the present invention has superelastic property while being Ni-free, excellent X-ray imaging property, processability, and strength property, and is suitable for a medical field.