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公开(公告)号：US09557651B2
公开(公告)日：2017-01-31
申请号：US14662659
申请日：2015-03-19
发明人： Shota Katayama , Yasushi Washio , Takahiro Shimizu
CPC分类号： G03F7/30 , G03F7/0045 , G03F7/0397 , G03F7/09 , G03F7/20 , G03F7/322 , G03F7/40
摘要： A chemically amplified positive-type photosensitive resin composition capable of suppressing the phenomenon of footing in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition. A mercapto compound is contained in the composition which includes an acid generator capable of producing an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.
摘要翻译： 一种化学放大型正型感光性树脂组合物，其能够抑制底部的宽度（支撑体的表面近侧）的宽度变得比顶部（接近表面的一侧 抗蚀剂层），当使用该组合物在基板的金属表面上形成用作电镀制品的模板的抗蚀剂图案时。 在组合物中含有巯基化合物，该组合物包含能够在用活性射线或辐射照射时能够产生酸的酸发生剂和在酸的作用下在碱中溶解度增加的树脂。
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公开(公告)号：US20150268553A1
公开(公告)日：2015-09-24
申请号：US14662659
申请日：2015-03-19
发明人： Shota Katayama , Yasushi Washio , Takahiro Shimizu
CPC分类号： G03F7/30 , G03F7/0045 , G03F7/0397 , G03F7/09 , G03F7/20 , G03F7/322 , G03F7/40
摘要： A chemically amplified positive-type photosensitive resin composition capable of suppressing the phenomenon of footing in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition. A mercapto compound is contained in the composition which includes an acid generator capable of producing an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.
摘要翻译： 一种化学放大型正型感光性树脂组合物，其能够抑制底部的宽度（支撑体的表面近侧）的宽度变得比顶部（接近表面的一侧 抗蚀剂层），当使用该组合物在基板的金属表面上形成用作电镀制品的模板的抗蚀剂图案时。 在组合物中含有巯基化合物，该组合物包含能够在用活性射线或辐射照射时能够产生酸的酸发生剂和在酸的作用下在碱中溶解度增加的树脂。
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公开(公告)号：US09244354B2
公开(公告)日：2016-01-26
申请号：US13708081
申请日：2012-12-07
发明人： Yasushi Washio , Tomoyuki Ando , Eiichi Shimura , Toshiaki Tachi
CPC分类号： G03F7/20 , G03F7/0045 , G03F7/0048
摘要： A method for producing a thick film photoresist pattern including laminating a thick photoresist layer including a chemically amplified positive-type photoresist composition for thick film on a support; irradiating the thick photoresist layer; and developing the thick photoresist layer to obtain a thick film resist pattern; in which the composition includes an acid generator, a resin whose alkali solubility increases by the action of an acid, and an organic solvent having a boiling point of at least 150° C. and a contact angle on a silicon substrate of no greater than 18°, in an amount of at least 40% by mass with respect to total mass of the organic solvent.
摘要翻译： 一种制备厚膜光致抗蚀剂图案的方法，包括将包括用于厚膜的化学放大正型光致抗蚀剂组合物的厚光致抗蚀剂层层压在载体上; 照射厚的光致抗蚀剂层; 并显影厚的光致抗蚀剂层以获得厚膜抗蚀剂图案; 其中所述组合物包括酸产生剂，其碱溶解度由酸的作用增加的树脂和沸点为至少150℃的有机溶剂和硅基底上的接触角不大于18的树脂 °，相对于有机溶剂的总质量为至少40质量％。
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4.发明授权Positive-type photoresist composition, photoresist laminate, method for producing photoresist pattern, and method for producing connecting terminal 有权正型光致抗蚀剂组合物，光致抗蚀剂层压体，光致抗蚀剂图案的制造方法以及连接端子的制造方法公开(公告)号：US09091916B2
公开(公告)日：2015-07-28
申请号：US13774891
申请日：2013-02-22
CPC分类号： G03F7/0397 , G03F7/0042 , G03F7/0045 , G03F7/20
摘要： What is provided is a positive-type photoresist composition containing an acid generator (A) capable of generating an acid when irradiated with an active ray or radiation, a resin (B) whose solubility in alkali increases under the action of acid, and an organic solvent (S), the photoresist composition further containing an alkali-metal salt (C).
摘要翻译： 提供了一种正型光致抗蚀剂组合物，其包含当用活性射线或辐射照射时能够产生酸的酸产生剂（A），其在碱的作用下在碱中的溶解度增加的树脂（B）和有机 溶剂（S），光致抗蚀剂组合物还含有碱金属盐（C）。
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5.发明申请POSITIVE-TYPE PHOTORESIST COMPOSITION, PHOTORESIST LAMINATE, METHOD FOR PRODUCING PHOTORESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL 有权正极型光电组合物，光电陶瓷层压板，生产光电子图案的方法和生产连接端子的方法公开(公告)号：US20130230801A1
公开(公告)日：2013-09-05
申请号：US13774891
申请日：2013-02-22
IPC分类号： G03F7/039
CPC分类号： G03F7/0397 , G03F7/0042 , G03F7/0045 , G03F7/20
摘要： What is provided is a positive-type photoresist composition containing an acid generator (A) capable of generating an acid when irradiated with an active ray or radiation, a resin (B) whose solubility in alkali increases under the action of acid, and an organic solvent (S), the photoresist composition further containing an alkali-metal salt (C).
摘要翻译： 提供了一种正型光致抗蚀剂组合物，其包含当用活性射线或辐射照射时能够产生酸的酸产生剂（A），其在碱的作用下在碱中的溶解度增加的树脂（B）和有机 溶剂（S），光致抗蚀剂组合物还含有碱金属盐（C）。
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公开(公告)号：US20130171572A1
公开(公告)日：2013-07-04
申请号：US13708081
申请日：2012-12-07
发明人： Yasushi Washio , Tomoyuki Ando , Eiichi Shimura , Toshiaki Tachi
IPC分类号： G03F7/20
CPC分类号： G03F7/20 , G03F7/0045 , G03F7/0048
摘要： A method for producing a thick film photoresist pattern including laminating a thick photoresist layer including a chemically amplified positive-type photoresist composition for thick film on a support; irradiating the thick photoresist layer; and developing the thick photoresist layer to obtain a thick film resist pattern; in which the composition includes an acid generator, a resin whose alkali solubility increases by the action of an acid, and an organic solvent having a boiling point of at least 150° C. and a contact angle on a silicon substrate of no greater than 18°, in an amount of at least 40% by mass with respect to total mass of the organic solvent.
摘要翻译： 一种制备厚膜光致抗蚀剂图案的方法，包括将包括用于厚膜的化学放大正型光致抗蚀剂组合物的厚光致抗蚀剂层层压在载体上; 照射厚的光致抗蚀剂层; 并显影厚的光致抗蚀剂层以获得厚膜抗蚀剂图案; 其中所述组合物包括酸产生剂，其碱溶解度由酸的作用增加的树脂和沸点为至少150℃的有机溶剂和硅基底上的接触角不大于18的树脂 °，相对于有机溶剂的总质量为至少40质量％。
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