METHOD FOR FORMING RESIST PATTERN
    3.
    发明申请

    公开(公告)号:US20170168396A1

    公开(公告)日:2017-06-15

    申请号:US15366244

    申请日:2016-12-01

    摘要: A method for forming a resist pattern including forming a first contact hole pattern including a hole portion and a hole-unformed portion, which includes alkali developing the exposed positive-type resist film; preparing a structure including the first contact hole pattern and a first layer which covers the first contact hole pattern, which includes forming a first layer by applying a solution including an acid or a thermal acid generator onto a support on which the first contact hole pattern is formed; forming organic solvent-soluble and organic solvent-insoluble regions on the hole-unformed portion, which includes heating the structure; and forming a second contact hole pattern on the hole-unformed portion, which includes developing the heated structure with an organic solvent.

    METHOD OF FORMING RESIST PATTERN
    4.
    发明申请
    METHOD OF FORMING RESIST PATTERN 有权
    形成电阻图案的方法

    公开(公告)号:US20160349617A1

    公开(公告)日:2016-12-01

    申请号:US15158992

    申请日:2016-05-19

    IPC分类号: G03F7/16 G03F7/32

    CPC分类号: G03F7/325 G03F7/405

    摘要: A method of forming a resist pattern including forming a first resist pattern on a substrate; applying a cross-linking composition so as to cover the first resist pattern; heating the covered first resist pattern and crosslinking an isocyanate group in the cross-linking composition with the first resist pattern; and developing the covered first resist pattern, wherein the cross-linking composition includes a blocked isocyanate compound having a protected isocyanate group.

    摘要翻译: 一种形成抗蚀剂图案的方法,包括在基板上形成第一抗蚀剂图案; 施加交联组合物以覆盖第一抗蚀剂图案; 加热被覆盖的第一抗蚀剂图案,并使交联组合物中的异氰酸酯基团与第一抗蚀剂图案交联; 并且显影所覆盖的第一抗蚀剂图案,其中所述交联组合物包括具有受保护的异氰酸酯基的封端异氰酸酯化合物。

    RESIST PATTERN FORMING METHOD AND DEVELOPER FOR LITHOGRAPHY
    5.
    发明申请
    RESIST PATTERN FORMING METHOD AND DEVELOPER FOR LITHOGRAPHY 有权
    电阻图形形成方法和开发者

    公开(公告)号:US20170059994A1

    公开(公告)日:2017-03-02

    申请号:US15241519

    申请日:2016-08-19

    IPC分类号: G03F7/32 G03F7/20

    CPC分类号: G03F7/322 G03F7/2059

    摘要: A method of forming a resist pattern including forming a resist film on a support using a resist composition; subjecting the resist film to exposure; and forming a resist pattern by developing the resist film having undergone the exposure, in which the developing is performed using a developer which contains a basic compound represented by the following formula (1) and tetrabutylammonium hydroxide, and in which the concentration of tetrabutylammonium hydroxide is equal to or greater than 2.5% by mass and less than 2.8% by mass: in which R1 to R4 each independently represent a linear or branched alkyl group, and the total number of carbon atoms contained in each of the alkyl groups represented by R1 to R4 is 4 to 15.