公开(公告)号：US20230201826A1

公开(公告)日：2023-06-29

申请号：US18116411

申请日：2023-03-02

Applicant: TOPPAN Inc.

Inventor： Keisuke GOTO ,  Yoichi MAKINO ,  Shinichi WADA ,  Yuichiro SHINOHARA

IPC: B01L3/00

CPC classification number: B01L3/502715 ,  B01L3/5025 ,  B01L2300/0829 ,  B01L2200/0689 ,  B01L2300/041

Abstract: A fluidic device including a substrate having a well array that includes regularly arranged wells that have a same shape and are open to a surface of the substrate, and a cover member facing the well array. The well array and the cover member are positioned to have a space therebetween, which forms a flow path through which a fluid flows, and the wells including a well A and a well B closest to the well A satisfy formula (1): 0.8≤Da/Dab