公开(公告)号：US10212810B2

公开(公告)日：2019-02-19

申请号：US15614335

申请日：2017-06-05

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Takanori Ohara ,  Kyoichi Yamamoto ,  Kentaro Kubota ,  Kenji Hayashi

IPC: H05K1/02 ,  H05K3/12 ,  H05K1/16 ,  H05K1/09 ,  H05K3/10 ,  H05K3/20 ,  H05K3/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00 ,  H05K1/03 ,  H05K3/40

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

公开(公告)号：US20130247977A1

公开(公告)日：2013-09-26

申请号：US13896853

申请日：2013-05-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koichi Kumai ,  Ryuji Ueda ,  Kentaro Kubota ,  Shigeki Kudo ,  Minoru Kawasaki

IPC: H01L31/02 ,  H05K1/02 ,  H05K3/20

CPC classification number: H01L31/02008 ,  H01L31/02021 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract translation: 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。