公开(公告)号：US20170171964A1

公开(公告)日：2017-06-15

申请号：US15271800

申请日：2016-09-21

申请人： International Business Machines Corporation

发明人： Charles L. Arvin ,  Brian M. Erwin

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K1/03 ,  H05K1/09 ,  H05K3/06

CPC分类号： H05K1/0275 ,  B05D3/102 ,  B41N1/083 ,  C23C22/66 ,  C23C22/76 ,  C23C22/78 ,  C25D11/04 ,  C25D11/045 ,  C25D11/16 ,  H01L23/57 ,  H05K1/00 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/115 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/07 ,  H05K2201/09681 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/033 ,  H05K2203/0369 ,  H05K2203/0392 ,  H05K2203/0733 ,  H05K2203/1142

摘要： A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

公开(公告)号：US20170018660A1

公开(公告)日：2017-01-19

申请号：US15277758

申请日：2016-09-27

申请人： DSM IP ASSETS B.V.

发明人： Koichi KUMAI ,  Ryuji UEDA ,  Kentaro KUBOTA ,  Shigeki KUDO ,  Minoru KAWASAKI

IPC分类号： H01L31/02 ,  H05K3/20 ,  H01L31/05 ,  H05K1/18

CPC分类号： H01L31/02008 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

摘要： A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

摘要翻译： 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。

公开(公告)号：US07718523B1

公开(公告)日：2010-05-18

申请号：US11875597

申请日：2007-10-19

申请人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

发明人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2224/03828 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/111 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K2201/10734 ,  H05K2203/033 ,  H05K2203/043 ,  H05K2203/0485 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.

摘要翻译： 焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。 使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。 在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。 随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。

公开(公告)号：US20090242257A1

公开(公告)日：2009-10-01

申请号：US12410699

申请日：2009-03-25

申请人： Shinichiro KAKEI ,  Kenji HORINO ,  Hitoshi SAITA ,  Yasunobu OIKAWA

发明人： Shinichiro KAKEI ,  Kenji HORINO ,  Hitoshi SAITA ,  Yasunobu OIKAWA

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/382 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2203/033

摘要： In a dielectric element, the side faces are roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate and insulating material is increased, adhesion with resin substrates is improved, and strength and reliability can be enhanced when buried between two resin substrates. In the dielectric element, the surface roughness Ra of side surfaces is 5000 nm or less, so that when burying the dielectric element between a glass epoxy resin substrate and insulating material, the occurrence of air bubbles between the surface of the dielectric element and the resin can be prevented.

摘要翻译： 在电介质元件中，侧面粗糙化，使得表面粗糙度Ra为15nm以上。 通过这种方式，玻璃环氧树脂基板和绝缘材料之间的接触面积增加，与树脂基板的粘合性提高，并且当埋在两个树脂基板之间时可以提高强度和可靠性。 在电介质元件中，侧面的表面粗糙度Ra为5000nm以下，因此当在玻璃环氧树脂基板和绝缘材料之间埋入电介质元件时，介电元件表面与树脂之间产生气泡 可以防止。

公开(公告)号：US20090120677A1

公开(公告)日：2009-05-14

申请号：US12205453

申请日：2008-09-05

申请人： Toshihiro NOMURA ,  Hiroshi SEGAWA ,  Yoshifumi MIYAZAWA ,  Katsuya OKUMURA

发明人： Toshihiro NOMURA ,  Hiroshi SEGAWA ,  Yoshifumi MIYAZAWA ,  Katsuya OKUMURA

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4046 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/033 ,  Y10T29/49155 ,  H01L2924/00

摘要： A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space.

摘要翻译： 提供了一种用于安装电子部件的布线基板及其制造方法。 布线基板包括基板，其包括第一表面，第二表面和多个通孔，所述多个通孔分别从第一表面延伸到第二表面以限定多个内壁。 布线基板还包括形成在基板的第一表面或第二表面中的至少一个上的外部导体。 在多个内壁之一上形成通孔导体，以便限定通孔导体空间，并与外部导体电连接。 还包括具有第一和第二端部的导电柱，所述第一柱端位于所述通孔导体空间中，使得所述第一柱端与所述通孔导体接触并与所述通孔导体电连接，并且所述第二端 后端项目脱离导体空间。

公开(公告)号：US06915566B2

公开(公告)日：2005-07-12

申请号：US09514762

申请日：2000-02-28

申请人： Donald C. Abbott ,  John E. Cotugno ,  Robert M. Fritzsche ,  Robert A. Sabo ,  Christopher M. Sullivan ,  David W. West

发明人： Donald C. Abbott ,  John E. Cotugno ,  Robert M. Fritzsche ,  Robert A. Sabo ,  Christopher M. Sullivan ,  David W. West

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/40 ,  H01K3/10

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0393 ,  H05K3/005 ,  H05K3/064 ,  H05K3/102 ,  H05K3/20 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4038 ,  H05K2201/09563 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0369 ,  H05K2203/0522 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (201) having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.

摘要翻译： 一种用于制造特别可用作面阵列集成电路封装的衬底的双面电互连柔性电路（200）的方法。 具有螺柱（203）的铜基体通过在相对表面上具有铜层的电介质膜（201）被挤压，从而在一步法中形成具有自对准固体铜通孔的柔性电路的中间结构。 通过用铜层镀覆两个表面来增强触点，并且使用常规工艺来完成电路图案化。

公开(公告)号：US06761302B1

公开(公告)日：2004-07-13

申请号：US09198849

申请日：1998-11-24

申请人： Yoshinobu Kaneyama

发明人： Yoshinobu Kaneyama

IPC分类号： B23K106

CPC分类号： H01L24/16 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13113 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81085 ,  H01L2224/81143 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0285 ,  H05K2203/033 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/048 ,  H05K2203/0776 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： When a substrate electrode (6) formed on a semiconductor substrate (5) and a device electrode (14) formed on an optical device (13) are joined to each other by solder to mount the device (13) on the substrate (5), a solder piece attached to the substrate electrode (6) is melted in inactive liquid (9) to form a solder bump (12). The substrate electrode (6) on which the solder bump (12) is formed and the device electrode (14) are matched with each other, and the device (13) is disposed so as to confront the substrate (5) in the inactive liquid (9). Thereafter, when the solder bump (12) is melted in the inactive liquid (9) and ultrasonic vibration (11) is applied to join the device electrode (6) and the substrate electrode (14) to each other, the positioning of the device electrode (14) to the substrate electrode (6) is performed by the surface tension of the melted solder bump (12), and then the solder bump (12) is solidified.

摘要翻译： 当形成在半导体衬底（5）上的衬底电极（6）和形成在光学器件（13）上的器件电极（14）通过焊料彼此接合以将器件（13）安装在衬底（5）上时， 附着在基板电极（6）上的焊接片在非活性液体（9）中熔化，形成焊料凸块（12）。 其上形成有焊料凸块（12）的基板电极（6）和器件电极（14）彼此匹配，并且将器件（13）设置成与非活性液体中的基板（5）相对 （9）。 此后，当焊料凸块（12）在非活性液体（9）中熔化并且施加超声波振动（11）以将器件电极（6）和衬底电极（14）彼此接合时，器件的定位 通过熔融的焊料凸块（12）的表面张力进行与基板电极（6）的电极（14）的接合，然后使焊料凸块（12）固化。

公开(公告)号：US06000603A

公开(公告)日：1999-12-14

申请号：US862804

申请日：1997-05-23

申请人： David C. Koskenmaki ,  Randolph D. Schueller ,  Robert P. McCollam

发明人： David C. Koskenmaki ,  Randolph D. Schueller ,  Robert P. McCollam

IPC分类号： H01L21/60 ,  B23K35/12 ,  H01L21/48 ,  H01L21/68 ,  H05K3/04 ,  H05K3/34 ,  B21D39/00 ,  B23K31/02

CPC分类号： H01L21/6835 ,  H01L21/4814 ,  H01L21/4853 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  H05K3/041

摘要： The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

摘要翻译： 本发明涉及一种制造金属球阵列的方法。 该方法包括在包括多个箔突起的金属箔上产生第一图案的步骤。 该方法还包括在载体基板上产生第二图案的步骤。 第二图案包括多个载体凹部，其布置和构造成与第一图案的箔片突起相对应。 该方法还包括以下步骤：将金属箔和载体衬底放置在一起，使得金属箔的箔突起配合在载体衬底的载体凹槽内，并熔化金属箔，使得箔突起形成位于 载体基板的载体凹部。 本发明还涉及通过上述方法构造的金属球阵列。

公开(公告)号：US5305523A

公开(公告)日：1994-04-26

申请号：US996445

申请日：1992-12-24

申请人： Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  James A. McDonald ,  Donald E. Myers ,  Joseph D. Peruffo ,  Thomas J. Walsh ,  Thomas J. Walsh, III

发明人： Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  James A. McDonald ,  Donald E. Myers ,  Joseph D. Peruffo ,  Thomas J. Walsh ,  Thomas J. Walsh, III

IPC分类号： H01L23/12 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/04 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K3/30

CPC分类号： H01L21/4839 ,  H05K1/16 ,  H05K3/4046 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/10416 ,  H05K2203/033 ,  H05K3/403 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

摘要： A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.

摘要翻译： 提供一种用于在冲压操作期间在诸如计算机部件的多层结构中形成一个或多个电导体的方法。 将导电片放置成与可变形电介质材料的片材直接接触。 使用冲头从片材形成导电块并同时将块塞转移到电介质材料中。 在传送操作期间，电介质材料的一部分被移位，以便引起芯块和电介质材料之间的机械干涉。

公开(公告)号：US5184767A

公开(公告)日：1993-02-09

申请号：US816134

申请日：1991-12-31

申请人： Howard S. Estes

发明人： Howard S. Estes

IPC分类号： B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34

CPC分类号： B23K35/0238 ,  B23K35/0227 ,  H05K3/3447 ,  H05K3/3478 ,  B23K35/26 ,  H05K2203/033 ,  H05K2203/0405 ,  H05K2203/0415 ,  H05K3/3421 ,  H05K3/3489

摘要： Wicking-resistant solder preforms and methods for making such preforms are provided. The preforms include a solder layer for electrically mounting a lead to a printed circuit board upon heating the solder above its flow temperature. The preform also includes a flux layer disposed in contact with the solder layer and a wicking barrier disposed on a component-facing side of the solder layer for minimizing solder wicking along the lead during subsequent reflow soldering operations.

摘要翻译： 提供防止锡芯的焊料预成型件和制造这种预制件的方法。 预成型件包括用于在将焊料加热到高于其流动温度的情况下将引线电连接到印刷电路板的焊料层。 预型件还包括与焊料层接触设置的焊剂层和布置在焊料层的面向组件的侧面上的芯吸屏障，用于在随后的回流焊接操作期间最小化沿引线的焊料芯吸。