公开(公告)号：US10986293B2

公开(公告)日：2021-04-20

申请号：US15976992

申请日：2018-05-11

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koichi Kumai ,  Ryohei Gorai

IPC: H01L27/14 ,  H04N5/369 ,  G02B3/00 ,  H01L27/146

Abstract: A solid-state imaging device including a substrate having a surface, microlenses formed on the surface, and a concave lens formed between adjacent ones of the microlenses and having a concave shape directed toward the surface of the substrate.

公开(公告)号：US09831567B2

公开(公告)日：2017-11-28

申请号：US15224756

申请日：2016-08-01

Applicant: YAZAKI CORPORATION ,  Toppan Printing Co., Ltd.

Inventor： Daisuke Miyakawa ,  Koichi Kumai

IPC: H01R4/10 ,  H01R4/18 ,  C23C28/02 ,  H01R13/03 ,  H01R43/16 ,  H01R4/62

CPC classification number: H01R4/188 ,  C23C14/32 ,  C23C28/023 ,  H01R4/185 ,  H01R4/62 ,  H01R13/03 ,  H01R43/16

Abstract: In a manufacturing method of an aluminum wire crimp terminal formed by a base material made of a copper-based metal, at the step of forming an intermediate worked material having an unfolded shape of the crimp terminal, fine recessed parts for promoting the adhesive performance of the crimp terminal against a conductor of the wire are formed on a plate-body surface forming an inner face of a conductor crimping part of the intermediate worked material. Subsequently, a thin-film surface layer made of an aluminum-based metal is formed on at least the plate-body surface. Finally, the intermediate worked material is bent to a prescribed terminal shape.

公开(公告)号：US20130247977A1

公开(公告)日：2013-09-26

申请号：US13896853

申请日：2013-05-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koichi Kumai ,  Ryuji Ueda ,  Kentaro Kubota ,  Shigeki Kudo ,  Minoru Kawasaki

IPC: H01L31/02 ,  H05K1/02 ,  H05K3/20

CPC classification number: H01L31/02008 ,  H01L31/02021 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract translation: 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。