公开(公告)号：US20220289976A1

公开(公告)日：2022-09-15

申请号：US17639626

申请日：2020-09-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Akira SHIMADA ,  Kazuyuki MATSUMURA ,  Yohei SAKABE ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: C08L79/08 ,  C08L63/00 ,  C08L71/12 ,  C08L83/06 ,  C08L83/16

Abstract: Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

公开(公告)号：US20240045329A1

公开(公告)日：2024-02-08

申请号：US18268411

申请日：2022-01-11

Applicant: TORAY INDUSTRIES, INC.

Inventor： Masaya JUKEI ,  Hisashi OGASAWARA ,  Hitoshi ARAKI

IPC: G03F7/028 ,  G03F7/032 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L23/66

CPC classification number: G03F7/028 ,  G03F7/032 ,  H01L23/3142 ,  H01L23/293 ,  H01L23/49894 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6677

Abstract: The purpose of the present invention is to provide a photosensitive resin composition and compound having a low dissipation factor when made into a cured film.
The present invention is a photosensitive resin composition containing (A) a polyfunctional monomer, (B) a binder resin, and (C) a photopolymerization initiator, the (A) polyfunctional monomer containing a compound represented by expression (1) and/or a compound represented by expression (2), and the (B) binder resin containing one or more substances selected from the group consisting of a polyimide, a polyimide precursor, a polybenzoxazole, a polybenzoxazole precursor, a polyamide, a copolymer thereof, a polyurea, a polyester, a polysiloxane, an acrylic resin, a phenol resin and a benzocyclobutene resin, and a maleic acid resin and a cycloolefin polymer.

公开(公告)号：US20230112804A1

公开(公告)日：2023-04-13

申请号：US17910120

申请日：2021-03-12

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: G03F7/028 ,  G03F7/038 ,  C08G73/10 ,  G03F7/037 ,  H01L23/29 ,  H01L23/498 ,  H01Q9/04

Abstract: The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).