公开(公告)号：US20220372288A1

公开(公告)日：2022-11-24

申请号：US17762900

申请日：2020-08-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki MATSUMURA ,  Yoshiko TATEOKA ,  Akira SHIMADA

IPC: C08L77/06 ,  C08L79/08 ,  C08J5/18 ,  C08L63/00

Abstract: In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

公开(公告)号：US20150318227A1

公开(公告)日：2015-11-05

申请号：US14650594

申请日：2014-01-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Akira SHIMADA ,  Koichi AOKI

IPC: H01L23/29 ,  C09J7/02 ,  C09J179/08 ,  H01L23/495

CPC classification number: H01L23/295 ,  C08G59/4042 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  C09J7/28 ,  C09J9/00 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2479/08 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49568 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/31721 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

Abstract translation: 本发明的目的是提供一种具有高导热性和优异粘合性的粘合剂组合物，其中控制导热填料的分散性，并且可以减轻冷/加热循环试验中的热应力。 一种含有可溶性聚酰亚胺（A），环氧树脂（B）和导热性填料（C）的粘合剂组合物，其特征在于含有三种具有特定结构的二胺残基，其含量 相对于100重量份的可溶性聚酰亚胺（A），环氧树脂（B）为30〜100重量份。

公开(公告)号：US20240034882A1

公开(公告)日：2024-02-01

申请号：US18265550

申请日：2021-12-08

Applicant: TORAY INDUSTRIES, INC.

Inventor： Seidai OKADA ,  Kazuya KIGUCHI ,  Akira SHIMADA

IPC: C08L83/10 ,  C08J5/18 ,  H01L21/683 ,  B32B7/02 ,  B32B15/20 ,  B32B9/04

CPC classification number: C08L83/10 ,  C08J5/18 ,  H01L21/6836 ,  B32B7/02 ,  B32B15/20 ,  B32B9/041 ,  C08J2383/10 ,  C08J2463/00

Abstract: The purpose of the present invention is to provide a resin composition which enables manufacturing an adhesive sheet for a electrostatic chuck which has excellent heat resistance, low elastic modulus, mitigates the substrate thermal expansion difference with a single layer, and is capable of adhesion and following. The resin composition contains a polymer (A) selected from polyimide and polyamic acid that have a diamine residue of a specific structure (below, the diamine residue (1)) and an acid anhydride residue of a specific structure (below, the acid anhydride residue (2)), and a thermosetting resin (B).

公开(公告)号：US20220289976A1

公开(公告)日：2022-09-15

申请号：US17639626

申请日：2020-09-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Akira SHIMADA ,  Kazuyuki MATSUMURA ,  Yohei SAKABE ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: C08L79/08 ,  C08L63/00 ,  C08L71/12 ,  C08L83/06 ,  C08L83/16

Abstract: Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.