公开(公告)号：US20240176239A1

公开(公告)日：2024-05-30

申请号：US18282909

申请日：2022-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kenta AOSHIMA ,  Yutaro KOYAMA ,  Kazuyuki MATSUMURA ,  Hitoshi ARAKI

IPC: G03F7/037 ,  C08G69/26 ,  C08G73/10 ,  C08G73/22

CPC classification number: G03F7/037 ,  C08G69/26 ,  C08G73/1053 ,  C08G73/22

Abstract: It is intended to provide a negative type photosensitive resin composition that ensures high aspect ratio pattern processability, high storage stability, and high curability and also provides a cured product with good mechanical characteristics and high heat resistance. A negative type photosensitive resin composition comprising a polymer compound (A), a cationic polymerizable compound (B), a cationic polymerization initiator (C), and a solvent (D) wherein the component (A) contains at least one compound selected from the group consisting of polyamide, polyimide, polybenzoxazole, precursors thereof, and copolymers thereof and wherein both the relations 0.6A≤B+0.5C≤0.98A and 0.05(B+C)≤C≤0.25(B+C) are satisfied where A (moles), B (moles), and C (moles) represent the quantities of all carboxylic acid residues, all diamine residues, and all monoamine residues, respectively, contained in the component (A).

公开(公告)号：US20150378258A1

公开(公告)日：2015-12-31

申请号：US14758101

申请日：2014-02-07

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi ARAKI ,  Mitsuhito SUWA ,  Toru OKAZAWA ,  Yoshihiko INOUE ,  Akihiro ISHIKAWA ,  Akinori SAEKI

IPC: G03F7/075 ,  G06F3/041 ,  G03F7/32 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20

CPC classification number: G03F7/0757 ,  G03F7/027 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/105 ,  G03F7/168 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

Abstract translation: 本发明的目的是提供一种理想的用于形成白色，阻光图案的负型感光着色组合物，其不仅具有优异的耐化学性，而且具有非常优异的耐热性，并且即使当 经历高温处理。 该负型感光性着色组合物含有（A）白色颜料，（B）通过含有特定结构的化合物的烷氧基硅烷化合物的共水解缩合得到的聚硅氧烷，（C）多官能丙烯酸类单体，（D）光自由基 聚合引发剂和（E）有机溶剂。

公开(公告)号：US20240376348A1

公开(公告)日：2024-11-14

申请号：US18684498

申请日：2022-08-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Takenori Fujiwara ,  Hitoshi ARAKI

IPC: C09J7/38 ,  C09J5/06 ,  C09J163/00 ,  C09J179/08 ,  H01L23/00

Abstract: The present invention aims to provide a pressure sensitive adhesive having high pressure sensitive adhesiveness and heat resistance and serves to makes it possible to transfer and mount a large number of semiconductor elements at once even when the process involves a step for applying heat to the semiconductor elements. It provides a pressure sensitive adhesive including a polyimide copolymer (A) having at least an acid dianhydride residue and a diamine residue and also comprising a dimer acid epoxy resin (B), wherein the diamine residue has a diamine residue (A1) as represented by the formula (1) in which n is a natural number of 1 or more and 15 or less (hereinafter referred to as the diamine residue (A1)), a diamine residue (A2) as represented by the formula (1) in which n is a natural number of 16 or more and 50 or less (hereinafter referred to as the diamine residue (A2)), and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as the diamine residue (A3)) and also wherein the diamine residue (A1) accounts for 50.0 mol % or more and 95.0 mol % or less, the diamine residue (A2) accounting for 1.0 mol % or more and 40.0 mol % or less, and the diamine residue (A3) accounting for 1.0 mol % or more and 30.0 mol % or less, of all diamine residues, which account for 100.0 mol %, in the polyimide copolymer (A).

公开(公告)号：US20240186172A1

公开(公告)日：2024-06-06

申请号：US18284195

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Risano NAKAJIMA ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: H01L21/683 ,  C08K5/00

CPC classification number: H01L21/6835 ,  C08K5/0025 ,  C08K5/0041 ,  H01L2221/68381

Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.

公开(公告)号：US20240166556A1

公开(公告)日：2024-05-23

申请号：US18284107

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Risano NAKAJIMA ,  Yukari ARIMOTO ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: C03C17/34 ,  H01L25/075

CPC classification number: C03C17/3405 ,  H01L25/0753 ,  C03C2217/78 ,  C03C2218/116 ,  C03C2218/32

Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.

公开(公告)号：US20220289976A1

公开(公告)日：2022-09-15

申请号：US17639626

申请日：2020-09-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Akira SHIMADA ,  Kazuyuki MATSUMURA ,  Yohei SAKABE ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: C08L79/08 ,  C08L63/00 ,  C08L71/12 ,  C08L83/06 ,  C08L83/16

Abstract: Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.

公开(公告)号：US20240126171A1

公开(公告)日：2024-04-18

申请号：US18270346

申请日：2021-12-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Hitoshi ARAKI

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/022

CPC classification number: G03F7/0382 ,  G03F7/0045 ,  G03F7/022 ,  G03F7/0384

Abstract: The present invention provides a hollow structure having a low acid ion content and low wiring corrosion when stored in high-temperature, high-humidity conditions. The present invention relates to a hollow structure in which an organic film (I) having a film thickness of 5-30 μm as a hollow structure support material and an organic film (II) having a film thickness of 5-30 μm as a hollow structure roof material are layered in said order from the upper surface of a substrate having a metal wiring, wherein, when the organic film (I) and the organic film (II) are independently evaluated by the following method for evaluating ion elution amounts, the total of the ion elution amount of the organic film (I) and the ion elution amount of the organic film (II) is no more than 4,000 ppm. (Ion elution amount evaluation method) An organic film is placed in pure water having a mass 10 times that of the organic film and is extracted in hot water for 10-20 hours at 100-121° C., after which the supernatant of the liquid extract is used as a sample solution. The sample solution and a target ion standard solution are introduced into an ion chromatography device, the concentrations of formate ions, acetate ions, propionate ions, and sulfate ions in the sample solution are determined by a calibration curve method, and a value obtained by converting the total of said concentrations into the mass of eluted ions relative to the mass of the organic film is used as the ion elution amount.

公开(公告)号：US20240045329A1

公开(公告)日：2024-02-08

申请号：US18268411

申请日：2022-01-11

Applicant: TORAY INDUSTRIES, INC.

Inventor： Masaya JUKEI ,  Hisashi OGASAWARA ,  Hitoshi ARAKI

IPC: G03F7/028 ,  G03F7/032 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L23/66

CPC classification number: G03F7/028 ,  G03F7/032 ,  H01L23/3142 ,  H01L23/293 ,  H01L23/49894 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6677

Abstract: The purpose of the present invention is to provide a photosensitive resin composition and compound having a low dissipation factor when made into a cured film.
The present invention is a photosensitive resin composition containing (A) a polyfunctional monomer, (B) a binder resin, and (C) a photopolymerization initiator, the (A) polyfunctional monomer containing a compound represented by expression (1) and/or a compound represented by expression (2), and the (B) binder resin containing one or more substances selected from the group consisting of a polyimide, a polyimide precursor, a polybenzoxazole, a polybenzoxazole precursor, a polyamide, a copolymer thereof, a polyurea, a polyester, a polysiloxane, an acrylic resin, a phenol resin and a benzocyclobutene resin, and a maleic acid resin and a cycloolefin polymer.

公开(公告)号：US20230112804A1

公开(公告)日：2023-04-13

申请号：US17910120

申请日：2021-03-12

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hisashi OGASAWARA ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC: G03F7/028 ,  G03F7/038 ,  C08G73/10 ,  G03F7/037 ,  H01L23/29 ,  H01L23/498 ,  H01Q9/04

Abstract: The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).