公开(公告)号：US20150378258A1

公开(公告)日：2015-12-31

申请号：US14758101

申请日：2014-02-07

申请人： TORAY INDUSTRIES, INC.

发明人： Hitoshi ARAKI ,  Mitsuhito SUWA ,  Toru OKAZAWA ,  Yoshihiko INOUE ,  Akihiro ISHIKAWA ,  Akinori SAEKI

IPC分类号： G03F7/075 ,  G06F3/041 ,  G03F7/32 ,  G03F7/40 ,  G03F7/16 ,  G03F7/20

CPC分类号： G03F7/0757 ,  G03F7/027 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0755 ,  G03F7/105 ,  G03F7/168 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04107

摘要： The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

摘要翻译： 本发明的目的是提供一种理想的用于形成白色，阻光图案的负型感光着色组合物，其不仅具有优异的耐化学性，而且具有非常优异的耐热性，并且即使当 经历高温处理。 该负型感光性着色组合物含有（A）白色颜料，（B）通过含有特定结构的化合物的烷氧基硅烷化合物的共水解缩合得到的聚硅氧烷，（C）多官能丙烯酸类单体，（D）光自由基 聚合引发剂和（E）有机溶剂。

公开(公告)号：US20230112804A1

公开(公告)日：2023-04-13

申请号：US17910120

申请日：2021-03-12

申请人： TORAY INDUSTRIES, INC.

发明人： Hisashi OGASAWARA ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC分类号： G03F7/028 ,  G03F7/038 ,  C08G73/10 ,  G03F7/037 ,  H01L23/29 ,  H01L23/498 ,  H01Q9/04

摘要： The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).

公开(公告)号：US20220289976A1

公开(公告)日：2022-09-15

申请号：US17639626

申请日：2020-09-25

申请人： TORAY INDUSTRIES, INC.

发明人： Hisashi OGASAWARA ,  Akira SHIMADA ,  Kazuyuki MATSUMURA ,  Yohei SAKABE ,  Hitoshi ARAKI ,  Masaya JUKEI

IPC分类号： C08L79/08 ,  C08L63/00 ,  C08L71/12 ,  C08L83/06 ,  C08L83/16

摘要： Provided are: a thermosetting resin composition, for use in an organic material suited to high frequency use, that has outstanding low dielectric tangent, heat resistance, flexibility, and ease of workability; a thermosetting resin sheet; an electronic component; and an electronic device. The present invention is a thermosetting resin composition that includes the following constituents (A1)-(C). (A1) Polyimide resin: a polyimide resin including a diamine residue with formula (8) and/or formula (9) (in formula (8), a, b, c, and d are integers 1 or greater that meet the conditions a+b=6-17 and c+d=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds) (in formula (9), e, f, g, and h are integers 1 or greater that meet the conditions e+f=5-16 and g+h=8-19, and the dashed lines denote carbon-carbon single bonds or carbon-carbon double bonds). (B) Phenylene ether resin: a phenylene ether resin that has a number average molecular weight of 500-5,000 and, at a terminal of a molecular chain, includes at least one cross-linked functional group selected from the group consisting of a phenolic hydroxyl group, an acryl group, a vinyl group, and an epoxy group. (C) Maleimide resin: a maleimide resin.