公开(公告)号：US20210116812A1

公开(公告)日：2021-04-22

申请号：US17041639

申请日：2019-03-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yoshinori MATOBA ,  Toshiyasu HIBINO ,  Mitsuhito SUWA

IPC: G03F7/075 ,  G03F7/20 ,  G03F7/40 ,  G03F7/039 ,  G03F7/008

Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

公开(公告)号：US20190101828A1

公开(公告)日：2019-04-04

申请号：US16095053

申请日：2017-04-17

Applicant: TORAY INDUSTRIES, INC.

Inventor： Toshiyasu HIBINO ,  Yoshinori MATOBA ,  Mitsuhito SUWA

IPC: G03F7/075 ,  C08G77/00 ,  C09D4/06 ,  C09D183/06 ,  C09D5/00 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40

Abstract: A resin composition including a polysiloxane (A) and a solvent (B), wherein the polysiloxane (A) contains at least one partial structure represented by any of the general formulae (1) to (3), and the relationship between the film thickness X and the film thickness Y, which respectively represent the thickness of a film produced by application of the resin composition and subsequent drying at 100° C. for 3 minutes and the thickness of the film after subsequent heating at 230° C. for 5 minutes, satisfies the following inequation: (X−Y)/x≤0.05. The resin composition exhibits excellent coating properties on rugged surface and has excellent planarization properties even if the resin composition is in a form of thin film. (R1 represents a single bond or a C1-4 alkyl group; R2 represents a C1-4 alkyl group; and R3 represents an organic group.)

公开(公告)号：US20240045331A1

公开(公告)日：2024-02-08

申请号：US18021707

申请日：2021-07-13

Applicant: TORAY INDUSTRIES, INC.

Inventor： Toshiyasu HIBINO ,  Hiroko MITSUI

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/038 ,  H01Q1/38

CPC classification number: G03F7/039 ,  G03F7/0047 ,  G03F7/0042 ,  G03F7/038 ,  H01Q1/38 ,  G06F3/041

Abstract: Provided is a photosensitive resin composition that makes it possible to suppress residue on a board. The photosensitive resin composition contains conductive particles (A) that have a coating layer that includes carbon, an alkali-soluble resin (B), a photoinitiator (C), and a solvent (D). The solvent (D) contains an amide solvent (dl).

公开(公告)号：US20170263663A1

公开(公告)日：2017-09-14

申请号：US15504089

申请日：2015-08-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Ryo NAGASE ,  Toshiyasu HIBINO ,  Ryosuke AIHARA

IPC: H01L27/146 ,  G03F7/09 ,  G03F7/038 ,  G03F7/031 ,  G03F7/004 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/40 ,  G03F7/00 ,  G03F7/16

CPC classification number: H01L27/14621 ,  G02B5/20 ,  G03F7/0007 ,  G03F7/004 ,  G03F7/0042 ,  G03F7/0045 ,  G03F7/031 ,  G03F7/038 ,  G03F7/091 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  H01L27/14 ,  H01L27/1462 ,  H01L27/14627 ,  H01L27/14685

Abstract: The invention provides a photosensitive coloring composition comprising a specific combination of a coloring agent, a photopolymerization initiator, and a photopolymerizable component that ensures excellent pattern processability and serves to produce a solid state imaging element with high image quality.