POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREFROM, AND SOLID STATE IMAGE SENSOR COMPRISING THE SAME

    公开(公告)号:US20210116812A1

    公开(公告)日:2021-04-22

    申请号:US17041639

    申请日:2019-03-27

    Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

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