公开(公告)号：US20190385867A1

公开(公告)日：2019-12-19

申请号：US16268538

申请日：2019-02-06

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Tomohiko SUGITA ,  Katsuhiro Sato ,  Hiroaki Ashidate

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/306 ,  H01L21/02

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.

公开(公告)号：US20210398825A1

公开(公告)日：2021-12-23

申请号：US17464007

申请日：2021-09-01

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Tomohiko SUGITA ,  Katsuhiro SATO ,  Hiroaki ASHIDATE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/306 ,  H01L21/687

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.