公开(公告)号：US20220356311A1

公开(公告)日：2022-11-10

申请号：US17634996

申请日：2020-12-22

Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation

Inventor： Kodai USHIWATA ,  Yu YAMASHITA ,  Tetsuo YOSHIMITSU ,  Takahiro IMAI ,  Hiromitsu HIRAI

IPC: C08J3/20 ,  C08G59/34 ,  C08G59/42 ,  H01B13/00 ,  H01B17/56 ,  H02K3/32

Abstract: A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method including: a filler mixing step of mixing a nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture; a shear mixing step of causing the mixture to be subjected to shear mixing; a diluent mixing step of mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing step; and a curing agent mixing step of mixing an acid anhydride curing agent with the mixture after the diluent mixing step.

公开(公告)号：US20240356402A1

公开(公告)日：2024-10-24

申请号：US18685930

申请日：2022-03-08

Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation

Inventor： Yu YAMASHITA ,  Tetsushi OKAMOTO ,  Jinxia XIE ,  Takahiro IMAI ,  Hiromitsu HIRAI

IPC: H02K3/04 ,  H02K3/32

CPC classification number: H02K3/04 ,  H02K3/32

Abstract: An insulating tape includes a base layer, two adhesive layers, and two reinforcing layers. The base layer has a first surface and a second surface opposite to the first surface. The two adhesive layers contain nano-sized silica particles, and each overlap a corresponding one of the first surface and the second surface. The two reinforcing layers are each provided for a corresponding one of the first surface and the second surface, and are bonded to the base layer by the adhesive layers.

公开(公告)号：US20230399504A1

公开(公告)日：2023-12-14

申请号：US18043053

申请日：2021-04-16

Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION

Inventor： Yu YAMASHITA ,  Tetsuo YOSHIMITSU ,  Kotaro MURA ,  Takahiro IMAI

IPC: C08L63/00 ,  C08K5/06 ,  C08G59/42 ,  C08K3/22 ,  C08J5/24 ,  H01B3/40

CPC classification number: C08L63/00 ,  C08K5/06 ,  C08G59/42 ,  C08K3/22 ,  C08J5/249 ,  B82Y30/00 ,  C08K2201/003 ,  C08K2201/011 ,  C08L2201/56 ,  C08L2203/202 ,  C08J2363/00 ,  H01B3/40

Abstract: A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated. The resin producing method includes a dispersion liquid mixing step of mixing an epoxy resin and a dispersion liquid in which a nanofiller is dispersed in a reactive diluent that reduces a viscosity of the epoxy resin by reacting with the epoxy resin, and a curing agent mixing step of mixing a composition produced by the dispersion liquid mixing step, with a curing agent that cures the epoxy resin. The epoxy resin includes, for example, an alicyclic epoxy resin.