公开(公告)号：US11051007B2

公开(公告)日：2021-06-29

申请号：US16699948

申请日：2019-12-02

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： Yu-An Cho ,  Wen-Chieh Lin ,  Ye-Quang Chen

IPC: H04N17/00 ,  G06T7/00

Abstract: A device to test image-capturing abilities of photosensitive components includes a movable assembly and a fixing assembly. The movable assembly includes a first wireless transmission module. The fixing assembly comprises a second wireless transmission module. The second wireless transmission module is wirelessly connected to the first wireless transmission module avoiding wire entanglement or winding as the movable assembly is rotated. The first wireless transmission module receives image signals from a camera module and wirelessly sends the image signals to the second wireless transmission module.

公开(公告)号：US11218686B2

公开(公告)日：2022-01-04

申请号：US16280232

申请日：2019-02-20

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： Ye-Quang Chen ,  Shin-Wen Chen ,  Jing-Wei Li ,  Chia-Wei Chen ,  Sheng-Jie Ding

IPC: H04N13/239 ,  G03B35/08 ,  H04N13/296 ,  H04N13/00

Abstract: A three-dimensional image-capturing device includes a first camera, a second camera, a driving member and a sensing member. The second camera is at one side of the first camera and is capable of being moved laterally by the driving member. After depth-sensing and establishing orientations in an image, the driving member is able to drive the second camera to move relative to the first camera, to change a distance between the first camera and the second camera. Such relative movement allows a greater range of three dimensionality for face recognition and other purposes.

公开(公告)号：US12088906B2

公开(公告)日：2024-09-10

申请号：US17577776

申请日：2022-01-18

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： Ye-Quang Chen ,  Chia-Weng Hsu ,  Wen-Ching Lai ,  Wan-Li Zhang

IPC: H04N23/57 ,  H04M1/02 ,  H05K1/18

CPC classification number: H04N23/57 ,  H05K1/183 ,  H04M1/0264 ,  H05K2201/10121

Abstract: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.

公开(公告)号：US10178285B2

公开(公告)日：2019-01-08

申请号：US15823720

申请日：2017-11-28

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Shin-Wen Chen ,  Ye-Quang Chen

IPC: G03B35/00 ,  H04N5/225 ,  F16M11/18 ,  G03B35/04 ,  G03B17/56 ,  G03B35/24

Abstract: A double-camera imaging device includes a base bracket and two camera units. The base bracket comprises a base plate, each camera unit comprises a printed circuit board, and the two camera units are fixed on the base plate and spaced apart each other via the printed circuit boards fixed on the base plate. The base bracket is configured to protect the two camera units from external force attack.