公开(公告)号：US09136442B2

公开(公告)日：2015-09-15

申请号：US13750097

申请日：2013-01-25

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Jui-Ping Weng ,  Hsiao-Wen Lee ,  Chun-Chih Chang ,  Min-Sheng Wu ,  Hsin-Hsien Lee

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/50 ,  H01L25/075

CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.

Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。

公开(公告)号：US20140209930A1

公开(公告)日：2014-07-31

申请号：US13750097

申请日：2013-01-25

Applicant: TSMC SOLID STATE LIGHTING LTD.

Inventor： Jui-Ping Weng ,  Hsiao-Wen Lee ,  Chun-Chih Chang ,  Min-Sheng Wu ,  Hsin-Hsien Lee

IPC: H01L27/15 ,  H01L33/50

CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.

Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。