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公开(公告)号:US20170181308A1
公开(公告)日:2017-06-22
申请号:US15060210
申请日:2016-03-03
Applicant: TYCO ELECTRONICS CORPORATION
Inventor: Nicholas John Swatko , Paul Craig Tally , Roenna Nepomuceno del Rosario , David A. Hurrell
CPC classification number: H05K7/1412 , B64D47/00
Abstract: A hold down assembly for an electronic unit includes a locking washer having a cone at a front end thereof. The locking washer has a tang provided in the cone and extending forward from the cone. The cone is configured to receive a mounting hook of the electronic unit with a first side of the tang bearing against the mounting hook to lock the position of the locking washer relative to the mounting hook. An actuator knob is rotatably coupled to the locking washer. The actuator knob is configured to be tightened to a threaded shaft to tighten the hold down assembly to the electronic unit and drive the locking washer toward the mounting hook.
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公开(公告)号:US20170245380A1
公开(公告)日:2017-08-24
申请号:US15047381
申请日:2016-02-18
Applicant: TYCO ELECTRONICS CORPORATION
Inventor: Hyo Chang Yun , Thomas D. Ratzlaff , Ismael L. Sandoval , David A. Hurrell , Bruce R. Conway , Peter J. Dutton
CPC classification number: H05K5/0213 , H01L23/36 , H01L23/564 , H05K5/03
Abstract: A thermal barrier for an electronic component includes an aerogel blanket configured to cover at least a portion of the electronic component and a cover positioned between the aerogel blanket and the electronic component. The aerogel blanket has a top, a bottom and edges therebetween. The bottom is configured to face the electronic component. The cover is a structurally reinforcing fabric affixed to the bottom of the aerogel blanket. The cover inhibits dust migration from the aerogel blanket toward the electronic component.
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公开(公告)号:US20150056443A1
公开(公告)日:2015-02-26
申请号:US14010386
申请日:2013-08-26
Applicant: Tyco Electronics Corporation
Inventor: Lei Wang , Hyo Chang Yun , David A. Hurrell
IPC: C09J127/20
CPC classification number: C09J127/20 , C08L27/12 , C08L27/16 , C08L27/18 , C08L2205/025 , C09J127/12 , C09J127/16 , C09J127/18 , Y10T428/2878
Abstract: An adhesive composition blend and an article are disclosed. The adhesive composition blend includes a higher-melt fluoropolymer component having a melting point greater than a predetermined maximum service temperature and a lower-melt fluoropolymer component having a melting point less than a predetermined applying temperature. The melting point of the higher-melt fluoropolymer is at least 20° C. greater than the melting point of the lower-melt fluoropolymer. Additionally or alternatively, the adhesive composition blend includes a higher-melt fluoropolymer component having a melting point between about 200° C. and about 330° C. and a lower-melt fluoropolymer component having a melting point between about 100° C. and about 260° C. The article includes a substrate and the adhesive.
Abstract translation: 公开了粘合剂组合物共混物和制品。 粘合剂组合物共混物包括具有大于预定最大使用温度的熔点的较高熔点含氟聚合物组分和熔点小于预定施加温度的较低熔点氟聚合物组分。 较高熔点含氟聚合物的熔点比低熔点含氟聚合物的熔点高至少20℃。 另外或替代地,粘合剂组合物共混物包括熔点在约200℃和约330℃之间的较高熔点含氟聚合物组分和熔点在约100℃和约 260℃。该制品包括基底和粘合剂。
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